Substrate Preheating with Zoned Light Output for Uniform Transfer
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Solution Overview
Problem
In existing substrate processing systems, pre-heating outside the processing device leads to a deterioration of in-plane temperature uniformity when the substrate is transferred to the processing device due to temperature differences between the substrate holding portions of the transfer mechanism and the substrate.
Innovation Solution
A heating device with light emitting elements that adjust light output based on substrate contact regions with the transfer mechanism, ensuring in-plane temperature uniformity by individually heating divided regions of the substrate before transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If uniform light output is used for all light emitting elements, then the heating structure is simple, but the in-plane temperature uniformity of the substrate deteriorates due to temperature loss during transfer
Solution Approach 1:
The patent applies local quality by differentiating the light output of light emitting elements based on their position relative to the substrate holding portion. Specifically, light emitting elements corresponding to regions that contact the transfer mechanism are set to have higher light output than other elements, compensating for temperature loss during transfer and achieving uniform in-plane temperature distribution across the substrate.
Solution Approach 2:
The heating device divides the substrate heating into multiple independent regions, each controlled by separate light emitting elements. This segmentation allows individual adjustment of light output for different substrate regions, enabling precise temperature control to compensate for localized heat loss during transfer.
2Productivity
If pre-heating is performed outside the processing device, then the throughput is improved, but the in-plane temperature uniformity deteriorates due to temperature differences between substrate holding portions and the substrate
Solution Approach 1:
The patent performs preliminary heating action outside the processing device to maintain substrate temperature before transfer. By pre-heating the substrate with adjusted light output in specific regions, the system compensates for upcoming heat loss during transfer, ensuring temperature uniformity is maintained when the substrate reaches the processing device, thus enabling high throughput without sacrificing temperature uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Maintains in-plane temperature uniformity of the substrate upon arrival at the processing device, enhancing processing results and throughput by minimizing temperature loss during transfer.
Implementation Method 1
a heating unit including light emitting elements for emitting light to individually heat divided regions of the substrate in plan view
Implementation Method 2
light emitting elements for emitting light to individually heat divided regions of the substrate
Data Source
AI summary
A heating device for heating a substrate before the substrate is transferred to a processing device is provided. The heating device includes a support unit configured to support the substrate, and a heating unit including light emitting elements for emitting the light to individually heat divided regions of the substrate in plan view, the substrate being supported by the support unit. Among the light emitting elements, light outputs of light emitting elements that correspond to regions of the substrate in contact with a substrate holding portion of a transfer mechanism are higher than light outputs of light emitting elements that correspond to other regions of the substrate, the transfer mechanism being disposed outside the heating device to hold and transfer the substrate between the heating device and the processing device.