Substrate Pressing Module for Semiconductor Warpage Control
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Solution Overview
Problem
The warpage phenomenon in semiconductor substrates due to different thermal expansion rates of materials during manufacturing processes leads to defects, as heat is not transferred uniformly, causing issues with pattern integrity and defect rates.
Innovation Solution
A substrate pressing module that applies a force to a partial area of the substrate from the upper side, using a support member, a weight member, and a pressing unit with a protrusion and driving member to uniformly distribute heat and prevent warpage, minimizing defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat treatment process is performed on substrate with warpage, then heat treatment is applied, but heat is not transferred uniformly causing defects
Solution Approach 1:
The substrate pressing module applies pressing force to the substrate before heat treatment to pre-flatten the substrate and eliminate warpage. This preliminary action ensures that when heat treatment subsequently occurs, the substrate maintains a flat state allowing uniform heat transfer across the entire surface, preventing defects and maintaining pattern integrity
2Productivity
If substrate warpage occurs during manufacturing, then material deposition continues, but different thermal expansion rates cause warpage phenomenon
Solution Approach 1:
The substrate pressing module acts as an intermediary device between the substrate and the manufacturing process. It applies controlled pressing force to counteract the warpage caused by differential thermal expansion of deposited materials, maintaining substrate flatness without interrupting the continuous manufacturing process
3Temperature
If substrate is pressed to prevent warpage, then heat transfer uniformity improves, but additional equipment complexity is introduced
Solution Approach 1:
The substrate pressing module applies pressing force locally to specific areas of the substrate where warpage occurs, rather than requiring complex global control mechanisms. This localized approach achieves uniform heat transfer improvement while keeping the device structure relatively simple through targeted intervention
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents and improves warpage, ensuring uniform heat transfer and minimizing defect rates in semiconductor substrates during manufacturing processes.
Implementation Method 1
a weight member provided to be positioned on the partial area of the substrate positioned on the support member and having a specific weight or more
Implementation Method 2
a pressing unit configured to apply a force to the weight member from the upper side
Data Source
AI summary
Disclosed is an apparatus for applying a force to a partial area of a substrate. The substrate pressing module includes a support member configured to support the substrate, a weight member provided to be positioned on the partial area of the substrate positioned on the support member and having a specific weight or more, and a pressing unit configured to apply a force to the weight member from the upper side.