Substrate Process for Embedded Components Using Micro-Imprinting

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Solution Overview

Problem

Conventional substrate processes for embedded components are complex and prone to contamination from residual glue and etchant chemicals, particularly during the removal of the stage and microlithography processes.

Innovation Solution

A substrate process involving a mold with protruding components, where a first dielectric layer covers the components, an electronic component is placed with contacts corresponding to the protrusions, and a micro-imprinting step forms openings in the dielectric layer, allowing for easy removal of the mold and prevention of contamination by residual etchant.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional substrate process is used with a stage and microlithography, then the substrate can be formed, but the active surfaces and contacts are contaminated by residual glue and etchant chemicals

Engineering Contradiction:

Improvecleanliness of contactsVSAvoidcontamination from residual glue and etchant

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The process separates the molding and opening formation steps. The mold creates the opening directly during molding, eliminating the need for separate microlithography and etching steps that cause contamination.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The openings are formed in advance during the molding process itself, before the substrate undergoes subsequent processing steps. This preliminary formation of openings prevents later contamination from etchant chemicals.

Inventive Principle:

Principle #10Preliminary action

2Ease of manufacture

If the stage is removed after forming electronic components, then the components can be transferred, but residual glue remains on the active surfaces

Engineering Contradiction:

Improvecomponent transfer processVSAvoidresidual glue on active surfaces

Core Design Contradiction:

Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The invention extracts the harmful glue layer by designing the mold to directly form openings that expose the contacts without requiring stage removal. The electronic components are transferred with the glue layer intact, eliminating the need to remove the stage and thus preventing glue residue on active surfaces.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

Instead of attaching components to a stage and then removing the stage, the invention inverts the approach by using a mold that directly forms the substrate structure with openings, allowing components to be transferred without stage removal and avoiding glue contamination.

Inventive Principle:

Principle #13The other way round (Inversion)

3Manufacturing precision

If microlithography and etching processes are used to form openings, then the contacts can be exposed, but chemical contamination occurs on contacts and dielectric layer

Engineering Contradiction:

Improveopening formation precisionVSAvoidchemical contamination from etchant

Core Design Contradiction:

Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The invention replaces the chemical etching process with a mechanical molding process. The mold physically forms the openings in the dielectric layer through mechanical action, eliminating the need for chemical etchants and preventing chemical contamination of contacts and dielectric surfaces.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The mold creates a physical copy or replica of the contact pattern directly in the dielectric layer. The opening formation is achieved by pressing the mold into the material, copying the contact geometry without requiring chemical processes.

Inventive Principle:

Principle #26Copying

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This process simplifies the substrate formation for embedded components, preventing contamination from residual glue and etchant chemicals, making it easier to practice and ensuring clean exposure of contacts.

Implementation Method 1

a first dielectric layer is formed on the surface and covers the protruding components

Methodology Applied

Scientific EffectDielectric layer formation: Deposition (physical)

Implementation Method 2

a micro-imprinting step is performed to form a plurality of openings on the first dielectric layer

Methodology Applied

Scientific EffectMicro-imprinting: Compression

Data Source

PatentUS7727818B2Substrate process for an embedded component

Publication Date: 2010.06.01 ADVANCED SEMICON ENG INC

AI summary

A first dielectric layer is formed on a mold having a surface and protruding components and covers the protruding components. At least one electronic component having an active surface, a back surface, and contacts formed on the active surface is disposed on the first dielectric layer. The active surface is faced to the first dielectric layer, and the contacts are corresponding to the protruding components. A second dielectric layer is formed on the first dielectric layer and a carrier is disposed on the back surface of the electronic component. Openings located corresponding to the contacts are further formed within the first dielectric layer by the protruding components in an imprinting step, such that when the mold is removed, the contacts are exposed from the openings.