Substrate Processing Apparatus with Adjustable Showerheads
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing substrate processing apparatuses face challenges in preventing substrate bowing due to stress from thin film deposition, which affects precision in subsequent processing steps. Additionally, controlling the distance and alignment between the substrate and showerheads is crucial for plasma generation and process gas supply.
Innovation Solution
A substrate processing apparatus that includes a chamber with an upper showerhead, a substrate supporter, and a lower showerhead assembly. The apparatus features a driving unit to adjust the gap and tilt the lower showerhead assembly, an elevation unit to adjust the gap between the substrate and the upper showerhead, and a tilting unit to tilt the substrate with respect to the upper showerhead.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If thin films are deposited on the top surface of the substrate, then the substrate receives the desired coating, but the stress of the thin films causes the substrate to bow
Solution Approach 1:
The patent applies preliminary anti-action by depositing a compensatory thin film on the bottom surface of the substrate that generates stress opposite to the stress from the top surface coating. This pre-applied counter-stress prevents substrate bowing before the coating process is complete, maintaining substrate flatness while achieving the desired top surface coating.
2Reliability
If the distance between the substrate and the upper showerhead is controlled to prevent plasma generation, then plasma is avoided, but the distance between the substrate and the lower showerhead must also be precisely controlled for process gas supply
Solution Approach 1:
The patent employs dynamics by making both the upper showerhead and lower showerhead assemblies adjustable relative to the substrate. The upper showerhead height is可调 to control plasma generation, while the lower showerhead position is可调 to optimize process gas supply. This dynamic adjustability allows independent optimization of both functions without increasing fundamental system complexity.
3Manufacturing precision
If the substrate and showerheads are aligned to be parallel, then alignment precision is improved, but it may be necessary to intentionally dispose them in a non-parallel configuration for specific process requirements
Solution Approach 1:
The patent applies dynamics by making the showerhead assemblies and substrate holder adjustable in orientation. Both the upper and lower showerheads can be tilted relative to the substrate, and the substrate itself can be tilted. This dynamic orientation control allows the system to switch between parallel alignment for high precision work and non-parallel configurations for specific process requirements, simultaneously achieving alignment precision and configuration flexibility.
Data Source
AI summary
A substrate processing apparatus includes a chamber, an upper showerhead, a substrate supporter, a lower showerhead assembly, a driving unit, an elevation unit, and a tilting unit. The chamber provides a processing space for a substrate, and the upper showerhead is provided in an upper region of an interior of the chamber. The substrate supporter is provided in the interior of the chamber to support the substrate, and the lower showerhead assembly is provided in an interior of the substrate supporter to supply process gas to the substrate. The driving unit adjusts a gap between the substrate and the lower showerhead assembly, and tilts the lower showerhead assembly with respect to the substrate. The elevation unit adjusts a gap between the substrate and the upper showerhead. The tilting unit tilts the substrate with respect to the upper showerhead.