Substrate Processing Apparatus Centrifugal Holding
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Solution Overview
Problem
Conventional substrate processing apparatuses face issues with processing liquid re-adhering to the substrate due to chuck pins positioned near the outer edge, causing splashing and air flow disturbances, which leads to inefficient processing and potential contamination.
Innovation Solution
A substrate processing apparatus with a rotary member that rotates freely about a vertical axis, supported by upward-facing supporting members and pressed against by inert gas to prevent re-adhering, eliminating the need for chuck pins and minimizing air flow disturbances.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If chuck pins are disposed near the outer edge of the substrate to position and support the substrate, then the substrate can be held and rotated, but the processing liquid directly hits and jumps at the chuck pins and re-adheres to the substrate surface
Solution Approach 1:
The invention extracts and removes the chuck pins from the system entirely. Instead of using traditional chuck pins to hold the substrate, the substrate is held by centrifugal force generated during rotation. This eliminates the source of the problem where processing liquid hits the chuck pins and re-adheres to the substrate.
Solution Approach 2:
The invention replaces the mechanical chuck pin holding system with a centrifugal force-based holding system. The substrate is accelerated to high rotation speeds, and the resulting centrifugal force presses the substrate against the rotary base member, eliminating the need for mechanical contact points that would interfere with processing liquid flow.
2Reliability
If chuck pins are disposed upward to the rotary base member to support the substrate, then the substrate can be positioned, but air flows around the edge surface of the substrate are disturbed, causing mist-like processing liquid to be sucked in and adhere to the substrate
Solution Approach 1:
The invention removes the chuck pins that were causing air flow disturbance. Without these mechanical support elements protruding upward, the air flow around the substrate edge surface remains undisturbed, preventing the suction effect that would draw mist-like processing liquid onto the substrate.
Solution Approach 2:
The invention replaces the mechanical chuck pin support system with a centrifugal holding system. The substrate is held against the rotary base member by centrifugal force during rotation, eliminating the need for upward-protruding mechanical supports that disrupt air flow patterns.
3Adaptability or versatility
If the substrate is opened and closed during processing to access the holding section, then the holding section can be processed, but the processing liquid can easily splash at the chuck pins
Solution Approach 1:
The invention removes the chuck pins entirely, eliminating the target for processing liquid splashing. The substrate holding and release mechanism is redesigned to not require protruding mechanical elements that would be vulnerable to liquid impact during opening and closing operations.
Solution Approach 2:
The invention replaces the chuck pin mechanical holding system with a centrifugal force-based system. The substrate can be held securely during rotation and released when needed, without exposing vulnerable mechanical contact points to processing liquid splashing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents processing liquid re-adhering to the substrate, ensuring uniform processing and reducing contamination, while maintaining stable substrate rotation and efficient processing liquid circulation.
Implementation Method 1
a pressing element which presses said substrate against said supporting members by supplying gas to a top surface of said substrate
Implementation Method 2
a substrate processing apparatus which performs predetermined processing by supplying a processing liquid to a substrate while rotating said substrate
Data Source
AI summary
In the vicinity of a rim portion of a spin base 5, a plurality of supports 7 which abut on a bottom rim portion of a substrate W and support the substrate W are formed projecting toward above from the spin base 5. The substrate W is supported horizontally by the plurality of supports 7, with a predetermined distance ensured from the spin base 5 which opposes the bottom surface of the substrate W. Into the space which is created between the top surface of the substrate W and an opposing surface 9a of an atmosphere blocker plate 9, inert gas is ejected from a plurality of gas ejection outlets 9b which are formed in the opposing surface 9a. The inert gas thus supplied to the top surface of the substrate W presses the substrate W against the supports 7 and the substrate W is held at the spin base 5.