Substrate Processing Apparatus Cold Heat Transfer Gap
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing substrate processing apparatuses face inefficiencies in heat exchange between freezing devices and substrate supports, particularly in maintaining ultra-high vacuum and extremely low temperatures for film formation, which affects the uniformity and quality of deposited films.
Innovation Solution
A substrate processing apparatus with a chiller and cold heat medium, where a coolant channel supplies coolant to a gap between the substrate support and the cold heat medium, utilizing a cold heat transfer material to enhance heat transfer efficiency, and a rotating device to adjust the distance between the target and substrate for improved film uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a gap is maintained between the substrate support and cold heat medium to enable rotation, then the substrate support can rotate freely, but heat transfer efficiency deteriorates due to the air gap insulation effect
Solution Approach 1:
A cold heat transfer material is introduced as an intermediary substance filling the gap between the substrate support and cold heat medium. This material mediates heat transfer from the cold heat medium through the substrate support while allowing rotational movement, resolving the contradiction between rotation capability and heat transfer efficiency.
Solution Approach 2:
The physical state and thermal properties of the gap are changed by introducing a cold heat transfer material. The material's thermal conductivity parameter is optimized to enable efficient heat transfer while maintaining the gap structure necessary for rotation, thus improving heat transfer efficiency without compromising rotational capability.
2Temperature
If coolant is supplied to the gap to improve heat transfer, then heat exchange efficiency improves, but coolant consumption increases
Solution Approach 1:
The cold heat transfer material serves as a solid intermediary that conducts heat without requiring continuous coolant flow through the gap. This eliminates the need for substantial coolant consumption while maintaining efficient heat exchange, as the material stores and transfers thermal energy directly from the cold heat medium.
Solution Approach 2:
The system replaces the mechanical coolant circulation system with a thermal conduction-based system using the cold heat transfer material. This substitution eliminates the need for pumps, flow control, and continuous coolant supply, thereby reducing coolant consumption while maintaining heat exchange efficiency.
3Temperature
If the substrate support is positioned close to the cold heat medium to improve heat transfer, then heat exchange efficiency improves, but the risk of condensation and contamination increases
Solution Approach 1:
The cold heat transfer material acts as a protective intermediary layer between the substrate support and cold heat medium. This layer enables thermal conduction while preventing direct contact, thereby eliminating the risk of condensation and contamination while maintaining heat exchange efficiency.
Solution Approach 2:
The cold heat transfer material provides localized thermal conductivity exactly where needed at the interface between the substrate support and cold heat medium, while the surrounding gap structure maintains rotational capability and prevents contamination. This localized quality optimization resolves the contradiction between heat transfer and contamination prevention.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient heat exchange, maintaining ultra-high vacuum and low temperatures, improving film uniformity and throughput while minimizing coolant consumption and processing costs.
Implementation Method 1
a cold heat transfer material disposed in the gap and being in contact with the substrate support and the cold heat medium so as to transfer heat therebetween
Data Source
AI summary
A substrate processing apparatus includes a processing chamber where a substrate support on which a substrate is placed and a target holder configured to hold a target are disposed, a freezing device disposed with a gap with respect to a bottom surface of the substrate support and having a chiller and a cold heat medium laminated on the chiller, and a rotating device configured to rotate the substrate support. The substrate processing apparatus further includes a first elevating device configured to raise and lower the substrate support, a coolant channel formed in the chiller to supply a coolant to the gap, and a cold heat transfer material disposed in the gap and being in contact with the substrate support and the cold heat medium so as to transfer heat therebetween.