Substrate Processing Condition Adjustment via Multi-Parameter Optimization
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Solution Overview
Problem
The complexity of modern semiconductor manufacturing processes, particularly with finer device patterns, makes it difficult to efficiently identify and correct abnormalities using single measurement and inspection results, especially with the introduction of liquid immersion exposure techniques which require higher accuracy and are affected by residual liquids on the substrate.
Innovation Solution
A method that collects and optimizes multiple measurement and inspection results across various substrate processing steps, adjusting processing conditions based on correlations between film thickness and alignment mark measurements to improve alignment and film formation conditions, and transmits these optimized conditions to relevant apparatuses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple measurement and inspection results are collected and optimized, then the accuracy of processing condition optimization is improved, but the complexity of the adjustment process increases
Solution Approach 1:
The adjustment process is segmented into three distinct modules: a collection process for gathering measurement/inspection results, an optimization process for analyzing the collected data, and a transmission process for sending optimized conditions to apparatuses. This segmentation makes the complex multi-parameter optimization manageable and systematic.
Solution Approach 2:
The adjustment method is designed to be universally applicable across multiple substrate processing apparatuses (film forming apparatus, exposure apparatus, etc.) and multiple measurement/inspection types. A single optimization framework handles diverse data sources and optimization targets, reducing the need for separate adjustment procedures for each case.
2Manufacturing precision
If film formation condition is optimized based on film thickness measurement, then film quality is improved, but alignment mark measurement may be affected due to film thickness changes
Solution Approach 1:
The system establishes a feedback relationship where film thickness measurement results are used to optimize film formation conditions, and simultaneously considers the impact on alignment mark measurements. The optimization process analyzes correlations between film thickness and alignment mark measurements to adjust conditions that benefit both film quality and measurement accuracy.
Solution Approach 2:
The optimization process adjusts film formation parameters (such as deposition rate, temperature, pressure) based on the measured film thickness and its correlation with alignment mark measurements. By changing these parameters systematically, the system achieves optimal film quality while minimizing negative impacts on subsequent alignment measurements.
3Manufacturing precision
If liquid immersion exposure is used for higher resolution, then pattern transfer accuracy is improved, but residual liquid on substrate causes problems in subsequent processings
Solution Approach 1:
The system extracts and identifies the specific problem of residual liquid on the substrate after liquid immersion exposure. By separately analyzing measurement results that indicate residual liquid presence, the optimization process can针对性地 adjust exposure and drying conditions to remove or minimize residual liquid effects while maintaining the high resolution benefits of liquid immersion exposure.
Data Source
AI summary
When a host issues an analysis order that specifically instructs the analytical contents to an analytical apparatus (step 401), the analytical apparatus collects two types of measurement and/or inspection results from a measurement and/or inspection instrument (steps 403 to 409), and in step 411, the analytical apparatus analyzes the measurement and/or inspection results and optimizes processing conditions of a series of processes related to wafer W. In step 411, data related to a processing state of a processing apparatus is acquired from the processing apparatus as needed. In step 413, the measurement and/or inspection results and the optimization results are accumulated in a database, and the optimization results are transmitted to various processing apparatuses (including the measurement and/or inspection instrument). After that, the analytical apparatus sends a processing end notice to the host (step 417).