Substrate Processing Condition Specification for Flat Surface
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Solution Overview
Problem
The surface of substrates processed with existing substrate processing apparatuses may not be flat due to uneven surface profiles before processing, particularly when the substrates are mechanically polished.
Innovation Solution
A method for specifying processing conditions that involves calculating prediction thickness information based on measured thickness values, evaluating these predictions to select the most suitable condition for achieving a flat surface, and adjusting processing times to ensure uniform treatment across the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If a substrate is mechanically polished before processing with processing liquid, then the surface flatness is improved, but the surface profile becomes uneven requiring additional processing
Solution Approach 1:
The patent measures the thickness distribution of the substrate before processing and uses this information to calculate and determine optimal processing conditions in advance. This preliminary measurement and calculation step allows the system to compensate for surface unevenness before the actual processing begins, eliminating the need for mechanical polishing while ensuring flat surface results.
Solution Approach 2:
The patent changes processing parameters (such as processing liquid flow rate, processing time, or nozzle position) based on the measured thickness distribution of the substrate. By dynamically adjusting these parameters according to the specific substrate characteristics, the system achieves uniform surface flatness without requiring mechanical polishing or dealing with complex surface profile issues.
2Manufacturing precision
If the discharge position of processing liquid is moved in radial direction to achieve uniform processing, then processing uniformity is improved, but processing time increases
Solution Approach 1:
The patent applies different processing conditions to different radial positions on the substrate. By moving the discharge position in the radial direction and adjusting processing parameters locally for each region, the system achieves uniform processing across the entire substrate surface while optimizing the processing time for each specific area rather than using a one-size-fits-all approach.
Solution Approach 2:
The patent dynamically adjusts the discharge position of the processing liquid in the radial direction during the processing operation. This dynamic movement allows the system to adapt to variations in substrate thickness and achieve uniform processing results while minimizing total processing time through optimized motion paths and speeds.
3Shape
If processing conditions are optimized for end area to achieve flat surface, then surface flatness is improved, but overall processing efficiency decreases
Solution Approach 1:
The patent determines specific processing conditions for the end area of the substrate based on measured thickness information, and applies these optimized conditions only where needed. By locally optimizing parameters for the end area rather than processing the entire substrate with uniform conditions, the system achieves flat surface results while maintaining overall processing efficiency through targeted rather than blanket processing.
Data Source
AI summary
A processing condition specifying method that includes Steps S31, S32, and S33. In Step S31, a prediction thickness information piece containing prediction values of thicknesses after processing on the substrate W is calculated for each of a plurality of recipe information pieces based on measurement thickness information containing measurement values of thicknesses of the substrate W. In Step S32, the prediction thickness information pieces each calculated for a corresponding one of the recipe information pieces are evaluated according to a prescribed evaluation method and a prediction thickness information piece is selected from among the prediction thickness information pieces. In Step S33, a recipe information piece corresponding to the selected prediction thickness information piece is specified. The measurement values contained in the measurement thickness information indicate a thickness of the substrate W measured before processing on the substrate W.