Substrate Processing Control Device for Dynamic Target Value Management
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Solution Overview
Problem
Existing substrate processing technologies face challenges in maintaining precise control when switching between different processes in the same apparatus, leading to suboptimal results and reduced product value due to the inability to reuse target values reflecting atmospheric changes.
Innovation Solution
A controlling device and method that optimizes and updates target values using feedback from measurement information, allowing continuous use of updated target values across different processing sequences within the same substrate processing apparatus, ensuring precise control and improved yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the same substrate processing apparatus performs multiple different processes, then the apparatus utilization is improved, but the manufacturing precision deteriorates because target values cannot be commonly used across different processes
Solution Approach 1:
The patent creates a target value management system where a single target value can be universally applied across multiple different processes in the same substrate processing apparatus. By storing target values independently of specific process recipes and enabling their reuse across different process sequences, the system achieves multi-functionality in target value application, resolving the contradiction between apparatus utilization and processing precision.
Solution Approach 2:
The patent merges the target value management with the feedback control system, combining the determination of target values based on atmospheric conditions with their application across multiple processes. This integration allows the same target value, optimized through feedback control for one process, to be applied to other processes, thereby maintaining precision while improving apparatus utilization.
2Manufacturing precision
If feedback control is performed separately for each process, then the manufacturing precision is maintained for each specific process, but the loss of time increases due to repeated target value determination
Solution Approach 1:
The patent implements preliminary action by determining and storing target values based on atmospheric conditions in advance, before actual processing begins. The feedback control system continuously monitors atmospheric conditions and pre-determines appropriate target values, which are then stored and readily available for immediate application when processes are switched, eliminating the time delay that would otherwise occur during target value determination.
Solution Approach 2:
The patent ensures continuity of useful action by maintaining continuous feedback control that constantly monitors atmospheric conditions and keeps target values updated and ready for use. This continuous operation eliminates interruptions and waiting time when switching between processes, as the target value determination and optimization continue uninterrupted in the background.
3Productivity
If the atmosphere inside the substrate processing apparatus changes during processing, then the productivity is improved through continuous processing, but the manufacturing precision deteriorates because the target value becomes outdated
Solution Approach 1:
The patent applies feedback control by continuously monitoring atmospheric conditions inside the substrate processing apparatus and using this information to dynamically adjust and update target values. When the atmosphere changes during continuous processing, the feedback system detects these changes and recalculates appropriate target values, ensuring that processing precision is maintained even as productivity increases through continuous operation.
Solution Approach 2:
The patent implements dynamics by making the target value adaptive and changeable in response to real-time atmospheric conditions. Rather than using fixed target values, the system dynamically adjusts target values based on current atmospheric state, allowing the control parameters to evolve continuously with changing processing conditions, thereby maintaining precision during continuous high-productivity operation.
Data Source
AI summary
A target value that serves as a control value with feed forward control is optimized. A TL performs a feed forward and a feedback control of a PM. A storage unit stores a plurality of recipes indicating different processing sequences, and a target value that serves as a control value when performing an etching process. A communication unit causes an IMM to measure a processing state of the wafer and receives measurement information. A computation unit computes a feedback value for the current wafer processed in the current cycle, based on pre-processing and post-processing measurement information for the wafer. An update unit updates the target value using the feedback value. A recipe adjustment unit changes the recipe to change the process performed in the same PM. When the process is performed after changing, the updated target value is used to perform feed forward control of the wafer in the same PM.