Substrate Processing Control Device Feedback Correction

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Solution Overview

Problem

In substrate processing, actual processing conditions often deviate from desired reference conditions due to apparatus layout issues, making it difficult to process substrates as intended.

Innovation Solution

A control device with a reading unit, estimation unit, comparison unit, and correction unit that reads reference processing conditions, estimates actual conditions, compares them, and corrects processing parameters to maintain desired outcomes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If substrate processing is performed with processing liquid according to reference conditions, then processing quality should be maintained, but actual processing conditions deviate from reference conditions due to apparatus layout issues

Engineering Contradiction:
Improveprocessing qualityVSAvoidcondition consistency
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent implements a feedback mechanism where the control device continuously monitors actual processing conditions (temperature, flow rate, processing time) and compares them against reference conditions. When deviations are detected, the system automatically adjusts processing parameters to maintain desired processing quality despite apparatus layout variations.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The control device dynamically changes processing parameters (temperature, flow rate, processing time) based on real-time monitoring of actual conditions. By adjusting these parameters in response to detected deviations, the system compensates for apparatus layout issues and maintains consistent processing quality.

Inventive Principle:
Principle #35Parameter changes

2Device complexity

If apparatus layout is fixed, then device complexity is reduced, but actual processing conditions cannot be controlled to match reference conditions

Engineering Contradiction:
Improveapparatus layoutVSAvoidprocessing condition accuracy
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The patent introduces dynamic control to a previously static system. The control device continuously monitors and adjusts processing parameters in real-time, transforming the fixed apparatus into a dynamically adaptable system that can compensate for layout constraints and maintain precise processing conditions.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The control device autonomously monitors actual processing conditions and self-adjusts parameters without external intervention. This self-service capability allows the system to automatically compensate for apparatus layout issues and maintain reference condition accuracy.

Inventive Principle:
Principle #25Self-service

Data Source

PatentUS11282727B2Control device of substrate processing apparatus and control method of substrate processing apparatus
Publication Date: 2022.03.22 TOKYO ELECTRON LTD
  • US11282727B2 patent drawing
  • US11282727B2 patent drawing
  • US11282727B2 patent drawing

AI summary

A control device of a substrate processing apparatus includes a reading unit, an estimation unit, a comparison unit, and a correction unit. The reading unit reads out a reference processing condition for processing a substrate. The estimation unit estimates an actual processing condition when the substrate is processed. The comparison unit compares the reference processing condition and the actual processing condition with each other. The correction unit corrects a processing condition for the substrate based on a comparison result in the comparison unit.