Substrate Processing Controller Timing Coordination
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Solution Overview
Problem
Conventional substrate processing apparatuses face challenges in preventing pattern collapse during drying of semiconductor wafers due to non-uniformity in transfer times and standby periods, leading to decreased yield.
Innovation Solution
A substrate processing apparatus with a controller that synchronizes the start timing of transfer processes to prevent overlap between the transfer of wafers with liquid films and other wafers, ensuring efficient transfer and reducing standby times, utilizing multiple processors and a transfer module to manage the timing of first and second processing stages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple substrates are processed simultaneously in parallel processors, then productivity is improved, but transfer timing coordination becomes complex causing non-uniformity in transfer times
Solution Approach 1:
The control device monitors the operational states of multiple processors and transfer modules in real-time, using this feedback information to dynamically adjust transfer timing commands. This ensures that even with parallel processing, each substrate receives uniform treatment and transfer timing is coordinated to prevent pattern collapse during drying.
Solution Approach 2:
The system transitions from static, pre-programmed transfer timing to dynamic, state-dependent timing control. The control device adapts transfer timing based on real-time processor states, liquid film formation status, and drying progress, allowing flexible coordination of multiple parallel processors while maintaining uniform transfer timing for all substrates.
2Manufacturing precision
If transfer timing is optimized to prevent overlap, then manufacturing precision is improved by preventing pattern collapse, but device complexity increases due to sophisticated timing control
Solution Approach 1:
The control device issues transfer timing commands in advance, before the actual transfer operation begins. By predicting when liquid films will form and when drying should occur, the system proactively schedules transfers to prevent pattern collapse, rather than reacting to problems after they occur. This reduces the need for complex real-time intervention mechanisms.
Solution Approach 2:
The control device acts as an intermediary between processors and transfer modules, centralizing timing coordination logic. Rather than requiring complex communication and coordination protocols between multiple independent processors and transfer modules, the control device mediates all timing decisions, simplifying the overall system architecture while achieving precise coordination.
3Ease of operation
If substrates wait for transfer operations to complete, then transfer coordination is simplified, but productivity decreases due to extra standby time
Solution Approach 1:
The system maintains continuous substrate processing by overlapping operations strategically. While one substrate undergoes drying, another can be transferred to a processor, and a third can be prepared for transfer. The control device coordinates these overlapping operations to ensure that no substrate waits unnecessarily, eliminating idle standby time while maintaining smooth transfer coordination.
Solution Approach 2:
The control device implements periodic transfer cycles with optimized intervals. By establishing regular, rhythmic transfer patterns synchronized with processor cycles and drying times, the system eliminates irregular waiting periods. Each substrate follows a predictable timeline with minimal standby time, while the periodic nature of operations simplifies coordination logic.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively suppresses non-uniformity in transfer times and reduces extra standby time, improving throughput and preventing pattern collapse during the drying process.
Implementation Method 1
form a liquid film for dry prevention on a surface of a semiconductor wafer
Implementation Method 2
perform a drying processing by bringing the wafer having the liquid film formed thereon into contact with a processing fluid in a supercritical state
Data Source
AI summary
A substrate processing apparatus includes first processors, second processors, a transfer module and a controller. Each of the first processors is configured to perform a first processing on a substrate. Each of the second processors is configured to perform a second processing on the substrate on which the first processing is performed. The transfer module is configured to transfer the substrate to the first processors and the second processors. The controller is configured to control the first processors, the second processors and the transfer module. The controller controls a start timing for a first transfer processing of transferring the substrates to the first processor such that a timing of a second transfer processing of transferring the substrate having a liquid film formed thereon to the second processor from the first processor and a timing when another substrate is transferred by the transfer module are not overlapped with each other.