Substrate Processing Solution for Copper Protection and Aluminum Etching
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Solution Overview
Problem
Current processing solutions for semiconductor substrates lack sufficient anticorrosion properties for copper and etching properties for aluminum, particularly in multi-metal layer configurations.
Innovation Solution
A processing solution comprising a compound that releases fluoride anions, a water-soluble organic solvent, water, and a nitrogen-containing aromatic compound, with a specific mass ratio of the nonionic component of the nitrogen-containing aromatic compound to the total amount of ammonia and ammonium ions, is used to enhance anticorrosion and etching properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-generated harmful factors
If a conventional cleaning solution containing peroxide is used to remove dry etching residues, then residue removal capability is improved, but anticorrosion properties for copper and etching properties for aluminum deteriorate
Solution Approach 1:
The patent changes the chemical composition parameters of the cleaning solution by incorporating specific fluorinated compounds and organic solvents in controlled ratios. This parameter optimization enables the solution to simultaneously achieve effective residue removal while maintaining selective reactivity that preserves copper layers and etches aluminum layers, resolving the contradiction between residue removal capability and metal-specific processing reliability
Solution Approach 2:
The patent creates a composite cleaning solution formulation that combines multiple chemical components (fluorinated compounds, organic solvents, and water) with specifically controlled mass ratios. This composite approach allows the solution to exhibit multiple functions: removing etching residues, protecting copper from corrosion, and enabling aluminum etching, thereby resolving the contradiction between residue removal and metal-specific property preservation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively removes etching residues while maintaining excellent anticorrosion properties for copper and etching properties for aluminum, even in substrates with multiple metal layers, such as copper, aluminum, and cobalt.
Implementation Method 1
a compound capable of releasing a fluoride anion
Implementation Method 2
a nitrogen-containing aromatic compound, in which a mass ratio of a nonionic component of the nitrogen-containing aromatic compound to a total amount of ammonia and an ammonium ion at 35° C. is more than 0.5 and less than 1
Data Source
AI summary
There are provided a processing solution, including: (a) a compound capable of releasing a fluoride anion or a salt thereof; (b) a water-soluble organic solvent; (c) water; and (d) a nitrogen-containing aromatic compound, in which a mass ratio of a nonionic component of the nitrogen-containing aromatic compound to a total amount of ammonia and an ammonium ion at 35° C. is more than 0.5 and less than 1; a method for processing a substrate; and a method for manufacturing a semiconductor substrate.