Substrate Processing Apparatus Cover Control for Contamination Reduction

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Solution Overview

Problem

In existing substrate processing apparatuses, substrates within standby containers are exposed to air, leading to potential particle attachment and contamination during the processing sequence, as the covers are kept open after wafer mapping but before subsequent processing begins.

Innovation Solution

A substrate processing apparatus with a controller that manages the opening and closing of substrate accommodation container covers, ensuring the cover is closed after wafer mapping and reopened only when processing of the second container's substrates is scheduled, minimizing exposure and enhancing throughput.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of time

If the cover of the second substrate accommodation container is kept opened after wafer mapping during standby, then wafer mapping can be completed and processing sequence can be prepared, but wafers are exposed to air causing particle attachment and contamination

Engineering Contradiction:

Improveprocessing preparation timeVSAvoidparticle attachment and contamination

Core Design Contradiction:

Loss of timeVSObject-affected harmful factors

Solution Approach 1:

Wafer mapping is performed in advance while the container is open, but the cover is closed after mapping completes. The system prepares the processing sequence beforehand, so when processing actually starts, everything is ready to proceed immediately without needing to keep the container open during standby.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The substrate accommodation container maintains a controlled atmosphere environment. By closing the cover after wafer mapping, wafers are protected from external air contamination while remaining in a stable, controlled environment during the standby period before processing begins.

Inventive Principle:

Principle #39Inert atmosphere (Inert environment)

2Object-affected harmful factors

If the cover is closed after wafer mapping, then particle attachment is prevented, but processing cannot begin until the cover is reopened

Engineering Contradiction:

Improveparticle attachment preventionVSAvoidprocessing start speed

Core Design Contradiction:

Object-affected harmful factorsVSProductivity

Solution Approach 1:

All necessary preparations including wafer mapping and processing sequence setup are completed while the container is open. The system pre-configures everything needed for processing, so when the cover is closed and later reopened, processing can begin immediately without delay.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The substrate accommodation container system automatically manages the cover opening/closing operations based on processing status. The controller seamlessly coordinates cover operations with processing requirements, eliminating manual intervention delays and ensuring rapid response when processing needs to start.

Inventive Principle:

Principle #25Self-service

3Productivity

If multiple substrate accommodation containers are processed sequentially with covers opened for mapping, then container utilization is maximized, but cumulative exposure time increases contamination risk

Engineering Contradiction:

Improvecontainer utilization efficiencyVSAvoidcumulative contamination exposure

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

Each substrate accommodation container maintains its own controlled atmosphere when closed. By closing containers after wafer mapping and keeping them sealed during standby, multiple containers can be efficiently managed sequentially while each wafer batch remains protected from contamination until its processing begins.

Inventive Principle:

Principle #39Inert atmosphere (Inert environment)

Solution Approach 2:

The system continuously manages multiple containers in an optimized sequence. While one container is being processed, another can be prepared with wafer mapping completed and cover closed. This continuous workflow maximizes container utilization while minimizing the time any container needs to remain open, reducing cumulative contamination exposure across all containers.

Inventive Principle:

Principle #20Continuity of useful action

Data Source

PatentUS9443748B2Substrate processing apparatus, program for controlling the same, and method for fabricating semiconductor device

Publication Date: 2016.09.13 KOKUSAI DENKI KK

AI summary

A substrate processing apparatus includes a mounting stand, a cover opening and closing unit, a substrate checking unit, a substrate transfer mechanism, a substrate processing unit, and a controller. While the substrate processing unit is processing a substrate within a first substrate accommodation container mounted on the mounting stand, when a second substrate accommodation container is mounted on the mounting stand, the controller provides control to open the cover of a second substrate accommodation container and check a substrate within the second substrate accommodation container by means of the substrate checking unit, and when the substrate checking is terminated, the controller provides control to close the cover of the second substrate accommodation container.