Substrate Processing Apparatus Dry Wet Transport Separation
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Solution Overview
Problem
Conventional substrate processing apparatuses face contamination issues due to the overlap of dry and wet substrate transport paths, leading to potential contamination of substrates after dry processing, which decreases yield.
Innovation Solution
A substrate processing apparatus with separate carry-in and carry-out ports for dry and wet substrates, utilizing distinct substrate transport units and chambers, and controlling dew point temperatures to prevent contamination and improve yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the same substrate transport unit and opening are used for both dry and wet substrate transport, then the device complexity is reduced, but contamination occurs between dry and wet processing paths
Solution Approach 1:
The substrate transport system is segmented into separate dry and wet transport paths. The dry substrate transport unit operates independently from the wet substrate transport unit, preventing cross-contamination while maintaining manageable system complexity through modular design
Solution Approach 2:
The wet substrate transport path is extracted and separated from the dry substrate transport path. By removing the contaminated wet transport function from the dry transport system, contamination is eliminated while the overall transport system remains integrated through coordinated operation
2Object-affected harmful factors
If separate carry-in and carry-out ports are used for dry and wet substrates, then substrate contamination is prevented, but the device complexity increases
Solution Approach 1:
The processing chamber is segmented with distinct carry-in and carry-out ports for dry and wet substrates. This spatial segmentation prevents contamination pathways while maintaining a unified chamber structure that manages complexity through organized functional zones
Solution Approach 2:
Separate transport units act as intermediaries between the external environment and the processing chamber. These intermediary components handle the contaminated wet substrate transport independently, protecting the main chamber structure from contamination while managing system complexity at the interface level
3Ease of operation
If dew point temperature is not controlled in the substrate transport chamber, then the system operation is simpler, but substrate contamination occurs due to moisture
Solution Approach 1:
The dew point temperature parameter is controlled and adjusted in the substrate transport chamber. By changing this thermal parameter, moisture condensation is prevented without requiring complex operational procedures, maintaining ease of operation while eliminating contamination
Solution Approach 2:
The substrate transport chamber maintains a controlled atmospheric environment with regulated dew point temperature. This creates an inert-like environment that prevents moisture-related contamination while keeping the system simple to operate through automated environmental control
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents contamination of substrates by separating dry and wet substrate transport paths and controlling dew point temperatures, thereby enhancing the processing yield.
Implementation Method 1
the anti-dry liquid coated on the surface of the substrate is substituted with carbon dioxide of supercritical state, and then the carbon dioxide is discharged, thereby drying the surface of the substrate
Implementation Method 2
a substrate is subjected to a dry processing with a supercritical fluid using a supercritical dry processing unit
Implementation Method 3
a phenomenon called a substrate surface pattern collapse occurs in which the pattern of the substrate surface collapses by the action of the surface tension of the processing liquid remaining on the substrate during the dry processing
Data Source
AI summary
A substrate processing apparatus is provided including: a liquid processing unit that processes a substrate with a processing liquid; a carry-in port formed in the liquid processing unit and configured to carry-in the substrate in a dry-state before the substrate is processed with the processing liquid; a carry-out port formed in the liquid processing unit and configured to carry-out the substrate in a wet-state after completing the liquid processing; a supercritical dry processing unit that performs a dry processing for the substrate using a supercritical fluid; a first substrate transport unit that transports the substrate in a dry-state before the substrate is processed with the processing liquid to the carry-out port of the liquid processing unit; and a second substrate transport unit that transports the substrate in a wet-state after completing the liquid processing from the carry-out port of the liquid processing unit to the supercritical dry processing unit.