Substrate Processing Apparatus Dummy Ejection Transition
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Solution Overview
Problem
The existing substrate processing apparatuses face challenges in efficiently switching from dummy ejection to main ejection, leading to prolonged processing times and reduced throughput due to temperature drops and flow rate fluctuations of the processing liquid.
Innovation Solution
A substrate processing apparatus and method that utilize a receiving unit with a container having an open top, which is movable between block and allowance positions, allowing for the adjustment and maintenance of processing liquid flow rate and temperature during the transition from dummy to main ejection, thereby preventing liquid from falling onto the substrate and ensuring consistent processing conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a dummy substrate is placed on the rotation table during dummy ejection, then the processing liquid can be adjusted to appropriate flow rate and temperature, but the operation to carry in/out the dummy substrate is required which prolongs processing time and reduces throughput
Solution Approach 1:
The invention extracts and removes the dummy substrate from the system by providing a through hole in the rotation table that allows the dummy substrate to be taken out through the bottom side. This eliminates the need for separate carry-in/out operations while maintaining the ability to perform dummy ejection for processing liquid adjustment.
Solution Approach 2:
Instead of carrying the dummy substrate into the chamber from the top, the invention inverts the approach by providing access from the bottom side through the through hole. The dummy substrate is loaded from the bottom and can be easily removed through the same path, reversing the conventional loading direction.
2Ease of operation
If the processing liquid supply is stopped after dummy ejection and then restarted for main ejection, then the dummy substrate can be carried out, but the temperature of the processing liquid drops and flow rate fluctuates, preventing desired processing rate
Solution Approach 1:
The invention maintains continuous supply of processing liquid through the ejecting unit even during the transition from dummy ejection to main ejection. The processing liquid flows continuously through the pipe and ejecting unit, preventing temperature drop and flow rate fluctuations that would occur with stopping and restarting the supply.
Solution Approach 2:
The through hole in the rotation table acts as an intermediary that allows the dummy substrate to be removed without interrupting the processing liquid supply. The liquid can flow continuously through the system while the dummy substrate is extracted through the bottom opening, decoupling these two operations.
3Manufacturing precision
If the nozzle is swung to standby position for processing liquid adjustment, then the liquid can be supplied to dummy dispense pot, but when main ejection starts the nozzle must swing back to ejection position causing temperature drop and flow rate fluctuation
Solution Approach 1:
The invention segments the dummy substrate removal operation from the nozzle positioning operations. The through hole provides a dedicated path for dummy substrate extraction that is independent of the nozzle swing movements, allowing these operations to occur simultaneously or in any sequence without interfering with each other.
Solution Approach 2:
The processing liquid supply is maintained in advance through the ejecting unit throughout the entire operation sequence. By keeping the liquid flowing continuously before, during, and after the dummy substrate removal and nozzle repositioning, the system is already at the desired temperature and flow rate when main ejection begins, eliminating stabilization delays.
Data Source
AI summary
The substrate processing apparatus includes: a rotating unit that holds and rotates a substrate; a processing liquid supply unit including an ejecting unit that supplies a processing liquid from the ejecting unit to a target surface of the substrate that is being rotated by the rotating unit so as to process the substrate; and the receiving unit 30 including a container having an open top, and relatively movable with respect to the ejecting unit 21 between a block position where the supply of the processing liquid from the ejecting unit 21 is blocked and an allowance position where the supply of the processing liquid from the ejecting unit is allowed.