Substrate Processing Apparatus Dynamic Solvent Vapor Ejection

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Solution Overview

Problem

Existing substrate processing technologies face challenges in efficiently replacing processing liquids with organic solvents, particularly in preventing pattern collapse during the drying process due to the time it takes to completely lift substrates from the liquid surface, leading to inefficiencies and potential damage.

Innovation Solution

A substrate processing apparatus with a liquid processing tank, movement mechanism, and gas ejector that immerses substrates in a processing liquid and then exposes them to a vapor of an organic solvent, where the ejection flow rate of the solvent vapor is dynamically adjusted as the substrates are lifted, ensuring efficient replacement of the processing liquid and minimizing pattern collapse.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If substrates are completely lifted from the liquid surface before solvent vapor exposure, then processing liquid can be fully replaced, but pattern collapse occurs during the lifting process

Engineering Contradiction:

Improvepattern integrityVSAvoidprocessing efficiency

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The ejector starts supplying organic solvent vapor to the substrates before they are completely lifted from the liquid surface. This preliminary action of introducing vapor during the lifting process prevents pattern collapse by providing vapor support to the patterns while they are still being extracted from the liquid, thus resolving the contradiction between maintaining pattern integrity and processing efficiency

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

Organic solvent vapor acts as an intermediary substance between the processing liquid and the final dried state of the substrate. The vapor is introduced during the transition phase (lifting process) to replace the processing liquid gradually, preventing pattern collapse while maintaining processing efficiency

Inventive Principle:

Principle #24Intermediary (Mediator)

2Loss of time

If substrates are lifted quickly from the liquid surface, then processing time is reduced, but pattern collapse occurs

Engineering Contradiction:

Improveprocessing timeVSAvoidpattern integrity

Core Design Contradiction:

Loss of timeVSReliability

Solution Approach 1:

The system introduces organic solvent vapor to the substrates during the lifting process itself, rather than waiting until lifting is complete. This preliminary vapor exposure during the critical transition phase prevents pattern collapse even when lifting occurs quickly, thus reducing processing time loss while maintaining pattern integrity

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The organic solvent vapor supply continues throughout the lifting process, providing continuous protection to the patterns. This continuous useful action ensures that patterns are protected at every moment during the transition from liquid to vapor phase, eliminating the need for slow lifting and thereby reducing processing time

Inventive Principle:

Principle #20Continuity of useful action

3Productivity

If organic solvent vapor is supplied at high flow rate, then solvent replacement efficiency is improved, but solvent consumption increases

Engineering Contradiction:

Improvesolvent replacement efficiencyVSAvoidsolvent consumption

Core Design Contradiction:

ProductivityVSLoss of substance

Solution Approach 1:

The ejection flow rate of the organic solvent vapor is dynamically adjusted based on the lifting position of the substrates. The flow rate is increased when substrates are at positions where pattern collapse risk is high and decreased when substrates are fully lifted, thereby maintaining high solvent replacement efficiency while reducing overall solvent consumption

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The system changes the flow rate parameter of organic solvent vapor based on the lifting position of substrates. By adjusting this parameter dynamically, the system achieves efficient solvent replacement during critical phases while minimizing solvent consumption during non-critical phases

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances the efficiency of solvent replacement, reduces the risk of pattern collapse, and optimizes the use of organic solvents by ensuring uniform solvent supply and efficient drying, improving the overall processing outcome.

Implementation Method 1

ejector that supplies a vapor of an organic solvent to portions of a plurality of substrates W that are exposed from the liquid surface

Methodology Applied

Scientific EffectVaporization: Evaporation

Implementation Method 2

a heater that heats the liquid stored in the liquid storage unit

Methodology Applied

Scientific EffectHeating: Heating

Data Source

PatentUS11476130B2Substrate processing apparatus, substrate processing method, and storage medium

Publication Date: 2022.10.18 TOKYO ELECTRON LTD

AI summary

A substrate processing apparatus includes a liquid processing tank, a movement mechanism, an ejector, and a controller. The liquid processing tank stores a processing liquid. The movement mechanism moves a plurality of substrates immersed in the liquid processing tank to a position above the liquid surface of the processing liquid. The ejector ejects a vapor of an organic solvent toward portions of the plurality of substrates that are exposed from the liquid surface. The controller changes an ejection flow rate of the vapor ejected by the ejector as the plurality of substrates are moved up.