Substrate Processing Feedback Control for Chamber Uniformity
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Solution Overview
Problem
Existing substrate processing methods face challenges in achieving uniform processing results across multiple chambers, leading to variations in characteristic values such as critical dimension (CD) and etching depth, which affect the accuracy and consistency of pre- and post-processing operations.
Innovation Solution
A substrate processing method that involves parallel processing of substrates in multiple chambers, where post-processing is followed by measurement and calculation of correction residual amounts, allowing for the adjustment of both pre- and post-processing conditions to minimize differences between actual and target values, thereby reducing variations in processing results.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If substrates are processed in parallel in multiple chambers, then productivity is improved, but variations in processing results increase
Solution Approach 1:
The patent implements a feedback mechanism where characteristic values (CD, etching depth) are measured after post-processing, correction residual amounts are calculated by comparing actual values with target values, and these residuals are used to update processing conditions for both pre-processing and post-processing. This closed-loop feedback system continuously optimizes processing parameters across multiple chambers to reduce variations and achieve uniform processing results while maintaining high productivity through parallel processing.
2Manufacturing precision
If processing conditions are adjusted to minimize differences between characteristic values and target values, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The control device employs feedback control where measurement information from post-processing is used to calculate correction residual amounts, which then feed back to adjust processing conditions. This systematic feedback approach automates the optimization process, reducing the need for manual intervention and complex manual tuning while improving manufacturing precision through data-driven parameter adjustments.
Solution Approach 2:
The patent replaces manual or mechanical adjustment methods with automated computational systems. The control device uses calculation units to automatically compute correction residual amounts and determine optimized processing conditions, substituting complex manual adjustment procedures with algorithm-based automated control, thereby improving precision without proportionally increasing operational complexity.
3Manufacturing precision
If correction residual amounts are calculated and used to update processing conditions, then manufacturing precision is improved, but loss of time increases
Solution Approach 1:
The patent applies preliminary action by updating processing conditions based on correction residual amounts calculated from previous cycle measurements. By proactively adjusting pre-processing and post-processing parameters before the next production cycle begins, the system prevents variations from occurring in the first place, thereby improving manufacturing precision without significant time loss during actual production. The measurement and correction activities are performed during idle or transition periods.
Data Source
AI summary
A substrate processing method includes performing a post-processing on a substrate subjected to a pre-processing, in the multiple chambers, acquiring a characteristic value of the substrate after the post-processing for respective chambers, calculating an actual value being an estimated value of the characteristic value when a processing condition of the post-processing is adjusted such that a difference between the characteristic value and a target value becomes small, acquiring a correction residual amount being a difference between the actual value and the target value for each chamber, calculating an average value of correction residual amounts of all of the chambers, correcting the pre-processing condition based on the average of the correction residual amounts, correcting the post-processing condition for each chamber based on the average of the correction residual amounts and the correction residual amount for each chamber; and performing the pre-processing and the post-processing based on the corrected conditions.