Substrate Processing System with Protective Film Coating
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Solution Overview
Problem
Existing substrate processing systems face challenges in cleaning the non-device surface of substrates without contaminating the device surface, particularly due to spatial limitations and the need to turn the substrate, which can result in contact between the turning member and the protected surface.
Innovation Solution
A substrate processing system that includes a first substrate holding unit for holding the substrate with the protected surface facing upward, a protective film coating nozzle to coat the peripheral edge of the protected surface, a turning unit to change the substrate's posture while preventing contact with the turning unit, and a cleaning unit to clean the target surface from above, utilizing a second substrate holding unit and a cleaning unit with suction or chuck pins to grip the substrate securely without direct contact with the protected surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the substrate is turned around by a turning member, then the cleaning target surface can be accessed from above, but the turning member contacts the protected target surface causing contamination
Solution Approach 1:
A protective film is applied as an intermediary layer on the protected target surface before turning. This film prevents direct contact between the turning member and the protected surface, thereby avoiding contamination while still allowing the substrate to be turned for cleaning access.
Solution Approach 2:
The protective film is applied in advance before the turning operation. This preliminary action ensures that the protected surface is already safeguarded before any potential contamination can occur during the turning and cleaning process.
2Area of stationary object
If the non-device surface is cleaned while facing downward, then space limitation is avoided, but the cleaning means cannot adequately access the surface due to members disposed below
Solution Approach 1:
Instead of cleaning the non-device surface while facing downward (conventional approach), the substrate is turned around and the cleaning target surface is cleaned while facing upward. This inversion allows cleaning members to adequately access and clean the surface from above, improving cleaning effectiveness.
3Manufacturing precision
If the protective film is coated only at the peripheral edge, then uniformity of the protective film is enhanced, but the protection coverage is reduced
Solution Approach 1:
The protective film coating is applied with different properties at different locations: the peripheral edge portion receives a coating that ensures uniformity and adequate protection, while the central portion may have different coating characteristics. This local differentiation optimizes both uniformity and protection coverage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for effective cleaning of the target surface while preventing contamination of the protected surface, enhancing the uniformity of the protective film and reducing the risk of adhesion of contamination substances, and enables efficient removal and drying of the protective film without liquid application.
Implementation Method 1
the first substrate holding unit includes a first suctioning/holding unit in which a central portion of the cleaning target surface is suctioned by the first base to hold the substrate
Implementation Method 2
a protective film coating nozzle which coats a protective film at least at a peripheral edge portion of the protected target surface
Implementation Method 3
a cleaning unit which cleans the cleaning target surface of the substrate that is held by the second substrate holding unit
Data Source
AI summary
The substrate processing system is provided with a first substrate holding unit which includes a first base that faces from below a substrate having a protected target surface and a cleaning target surface on the opposite side of the protected target surface and holds the substrate in a first posture in which the protected target surface is facing upward, a protective film coating nozzle which coats a protective film at least at a peripheral edge portion of the protected target surface of the substrate that is held by the first substrate holding unit, a first turning unit which turns around the substrate while in contact with a peripheral edge portion of the substrate so that the posture of the substrate can be changed from the first posture to a second posture in which the protected target surface is facing downward, a second substrate holding unit which includes a second base that faces the substrate from below and holds the substrate in the second posture, and a cleaning unit which cleans the cleaning target surface of the substrate that is held by the second substrate holding unit.