Substrate Processing Film Formation for Contaminant Removal

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Solution Overview

Problem

Existing substrate processing methods struggle to efficiently remove contaminants from substrates with complex and fine uneven patterns, as the topcoat film dissolves on the substrate, causing removal objects to reattach.

Innovation Solution

A substrate processing method involving a processing liquid with a dissolution component that partially dissolves the front layer of the substrate and removal objects, forming a processing film that holds removal objects, which is then removed with a removing liquid.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a topcoat liquid is supplied to form a topcoat film by volatilization, then removal objects are separated from the substrate, but the topcoat film dissolves on the substrate causing removal objects to reattach

Engineering Contradiction:

Improveremoval object separationVSAvoidtopcoat film stability

Core Design Contradiction:

ReliabilityVSStability of the object's composition

Solution Approach 1:

The patent changes the physical and chemical parameters of the processing liquid by controlling the ratio of volatile component to dissolution component, and adjusting concentration and temperature parameters to achieve optimal film formation and removal object entrapment without excessive dissolution

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent utilizes phase transition of the volatile component from liquid to gas through controlled heating or reduced pressure, enabling the processing liquid to form a solid or gel processing film that traps removal objects while the volatile component evaporates

Inventive Principle:

Principle #36Phase transitions

2Reliability

If a processing liquid with dissolution component is used to partially dissolve the front layer and removal objects, then the processing liquid enters between removal objects and substrate, but excessive dissolution may damage the substrate

Engineering Contradiction:

Improveremoval object entrapmentVSAvoidsubstrate damage

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent applies partial dissolution by controlling the dissolution component concentration and exposure time to achieve sufficient penetration between removal objects and substrate without excessive dissolution that would damage the front layer, using just enough dissolution action required

Inventive Principle:

Principle #16Partial or excessive action

Solution Approach 2:

The patent maintains continuous action of the processing liquid on the substrate surface, allowing the dissolution component to work continuously at controlled rates, ensuring complete penetration and entrapment while preventing localized excessive dissolution through continuous replenishment and uniform distribution

Inventive Principle:

Principle #20Continuity of useful action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enables efficient removal of removal objects from substrates by forming a processing film that maintains a sufficient holding force, preventing reattachment and facilitating quick removal.

Implementation Method 1

The processing liquid contains a dissolution component which dissolves at least one of a front layer of the substrate and the removal objects as a dissolution object

Methodology Applied

Scientific EffectDissolution: Solvation

Implementation Method 2

the processing liquid on the surface of the substrate is solidified or cured to form a processing film that holds removal objects present on the surface of the substrate

Methodology Applied

Scientific EffectSolidification: Freezing

Implementation Method 3

the processing liquid on the surface of the substrate is solidified or cured to form a processing film

Methodology Applied

Scientific EffectCuring: Photopolymerisation

Data Source

PatentUS12269068B2Substrate processing method and substrate processing device

Publication Date: 2025.04.08 SCREEN HOLDINGS CO LTD

AI summary

A substrate processing method that includes a processing liquid supplying step which supplies a processing liquid to a surface of a substrate, a processing film forming step in which the processing liquid on the surface of the substrate is solidified or cured to form a processing film that holds removal objects present on the surface of the substrate, and a removing step in which a removing liquid is supplied to the surface of the substrate to thereby remove the processing film from the surface of the substrate in a state that the removal objects are held by the processing film. The processing liquid contains a dissolution component which dissolves at least one of a front layer of the substrate and the removal objects as a dissolution object. The processing liquid supplying step includes a dissolution step which partially dissolves the dissolution object by the dissolution component in the processing liquid supplied to the surface of the substrate.