Substrate Processing Apparatus Flow Passage Temperature Control
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Solution Overview
Problem
Conventional substrate processing apparatuses face challenges in accurately maintaining processing liquids at high temperatures due to thermal influences from pipe walls, leading to inconsistent temperature supply and processing uniformity issues.
Innovation Solution
The apparatus includes a circulation flow passage, discharge flow passage, and return flow passage configuration where the return flow passage is connected inside the chamber, reducing the distance from the connecting position to the discharge port, and optionally features a discharge heater and multiple discharge ports to ensure accurate high-temperature liquid supply and improved uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the return flow passage is connected inside the processing liquid supplying unit, then the circulation path is complete and stable, but the downstream portion of the discharge flow passage becomes longer and more exposed to room temperature, causing temperature loss
Solution Approach 1:
The patent relocates the return flow passage connection point from inside the processing liquid supplying unit to inside the chamber, changing the spatial dimension of the connection location. This dimensional change shortens the downstream discharge flow passage length while maintaining circulation stability, thereby reducing temperature loss in the processing liquid.
2Ease of manufacture
If the downstream portion of the discharge flow passage is longer, then the connecting position can be arranged inside the processing liquid supplying unit, but the processing liquid is more influenced by room temperature and discharged at lower temperature than desired
Solution Approach 1:
The patent changes the spatial location of the return flow passage connection from inside the processing liquid supplying unit to inside the chamber. This dimensional relocation shortens the downstream discharge flow passage, reducing the processing liquid's exposure to room temperature and improving temperature control precision while maintaining ease of manufacture.
3Temperature
If the discharge flow passage downstream portion is shortened by connecting the return flow passage inside the chamber, then temperature maintenance is improved, but the circulation path becomes more complex
Solution Approach 1:
The patent relocates the return flow passage connection to inside the chamber, which shortens the downstream discharge flow passage and improves temperature maintenance. While this changes the flow passage configuration, the overall system complexity remains manageable as it involves relocating an existing connection point rather than adding new components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration maintains the processing liquid at a desired high temperature from the start of supply, reduces thermal effects, and enhances uniform processing across substrates by minimizing temperature variations and extending the processing liquid's high-temperature retention.
Implementation Method 1
the circulation flow passage circulates the processing liquid, while maintaining the processing liquid at a predetermined temperature not less than a normal temperature
Implementation Method 2
optionally features a discharge heater
Data Source
AI summary
A discharge port 31 is arranged inside a chamber 9. A circulation flow passage 50 circulates a processing liquid, while maintaining the processing liquid at a predetermined temperature. A discharge flow passage 32 is branched from a circulation flow passage 50 to guide the processing liquid to the discharge port 31. A return flow passage 33 is connected to the discharge flow passage 32 inside the chamber 9 and allows the processing liquid running through the discharge flowpassage 32 to flow back to the circulation flow passage 50.