Substrate Processing Apparatus Flow Path Bent Parts
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Solution Overview
Problem
Conventional substrate processing using supercritical fluids faces issues with pressure fluctuations due to partial vaporization of processing fluids in the flow path, which can cause damage to substrates with fine patterns during drying.
Innovation Solution
The substrate processing apparatus incorporates a flow path with multiple bent parts that increase pressure loss, causing vaporization to occur earlier and reducing the likelihood of pressure fluctuations reaching the processing space, thereby protecting the substrate from damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If pressure feeding is used to supply processing fluid in liquid state, then supply efficiency is improved, but pressure fluctuation occurs due to partial vaporization causing substrate damage
Solution Approach 1:
A buffer chamber is introduced as an intermediary component between the pressure feeding system and the processing space. This buffer chamber absorbs pressure fluctuations caused by partial vaporization of the processing fluid, preventing them from reaching the substrate. The buffer chamber acts as a mediator that decouples the harmful pressure variations from the substrate while maintaining efficient fluid supply.
Solution Approach 2:
The buffer chamber provides beforehand cushioning by being positioned upstream in the flow path where pressure fluctuations first occur. It cushions the pressure variations before they can propagate to the substrate, protecting the substrate from damage. This prior cushioning approach prevents the harmful effects of pressure fluctuation rather than reacting to them after occurrence.
2Manufacturing precision
If processing fluid is supplied in supercritical state, then processing quality is improved, but maintaining predetermined temperature and pressure throughout supply path increases system complexity
Solution Approach 1:
The processing fluid is supplied in liquid or gas state beforehand, and the conversion to supercritical state occurs within the processing chamber itself. This preliminary action approach allows the fluid to be prepared in a simpler state during supply, reducing the complexity of maintaining supercritical conditions throughout the entire supply path, while still achieving high-quality processing.
Solution Approach 2:
The physical state of the processing fluid is changed from liquid or gas to supercritical state through parameter changes (temperature and pressure) that occur within the processing chamber. This allows flexible control of the fluid state at different locations, maintaining simplicity in the supply path while achieving the desired supercritical processing conditions in the chamber.
3Ease of operation
If processing fluid is supplied in liquid state, then ease of supply is improved, but partial vaporization occurs causing pattern collapse
Solution Approach 1:
The buffer chamber serves as an intermediary that prevents the direct transmission of vaporization-induced pressure shocks to the substrate. By positioning the buffer chamber in the flow path, it mediates between the liquid processing fluid supply and the substrate, absorbing the harmful effects of partial vaporization while maintaining the ease of liquid state supply.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses pressure fluctuations from reaching the substrate, preventing pattern collapse and ensuring efficient processing by maintaining a stable environment for supercritical fluid processing.
Implementation Method 1
The pressure loss in the bent parts is larger than that in other parts of the flow path
Implementation Method 2
a part of the liquid may vaporize due to, for example, the fluctuation in the pressure loss in the flow path
Implementation Method 3
As a result, the fluid expands abruptly
Data Source
AI summary
The disclosure provides a substrate processing apparatus that processes a surface of a substrate with a processing fluid in a supercritical state, in which the substrate is protected from the pressure fluctuation caused by partial vaporization of the processing fluid in the flow path. A substrate processing apparatus which processes a surface of a substrate with a processing fluid in a supercritical state includes a chamber housing provided therein with a processing space capable of housing the substrate and a flow path which receives the processing fluid from outside and guides the processing fluid to the processing space, and a fluid supply part which pressure-feeds the processing fluid to the flow path, wherein a plurality of bent parts which change a flow direction of the processing fluid are provided in the flow path.