Substrate Processing Apparatus Heat Exchange Manifold Temperature Control

The heat exchange unit is divided into multiple segments (first heat exchange unit with multiple first heat exchange members, second heat exchange unit with multiple second heat exchange members) arranged in series along the gas flow path. This segmentation allows progressive heat extraction at different stages, effectively reducing the temperature of carrier gas before it reaches the manifold while maintaining temperature homogeneity in the process chamber.

The heat exchange unit acts as an intermediary between the hot process chamber and the manifold. It introduces heat exchange members that contact the carrier gas flow and transfer excess heat to these members, which then dissipate it to the surrounding environment. This intermediary mechanism prevents direct heat transportation to the manifold while maintaining process chamber temperature control.

The heat exchange unit is positioned to intercept carrier gas before it reaches the manifold. By performing preliminary cooling of the carrier gas in the region between the substrate holder and manifold, the system prevents intense heat transportation from reaching the manifold components. This preliminary action allows high-temperature substrate processing while protecting the manifold from thermal damage.

The intense heat and radiation from high-temperature substrate processing, which would normally be harmful to the manifold, are converted into a beneficial cooling opportunity. The heat exchange members absorb this excess thermal energy from the carrier gas and radiation, transferring it to the heat exchange unit structure which then dissipates it safely. The harmful thermal energy is thus converted into a controllable heat exchange process that protects the manifold.