Substrate Processing Apparatus Heat Exchanger Insulation

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Solution Overview

Problem

Conventional substrate processing apparatuses face challenges in maintaining the temperature of the manifold at a heat-resistant level due to heat radiation and energy transport from the substrate, leading to potential heat deterioration of components, especially at the lower side of the process chamber.

Innovation Solution

The apparatus incorporates a first heat exchanger with a hollow cylindrical insulating tube and an insulating plate, performing heat exchange with the gas flowing downward, and a lower insulating part with lower thermal conductivity to manage heat transfer and radiation, while an insulating ring further suppresses heat introduction to critical components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If carrier gas is supplied to process substrates at high temperature, then substrate processing is effective, but heat energy is transported to the manifold causing temperature increase

Engineering Contradiction:

Improvesubstrate processing efficiencyVSAvoidmanifold temperature

Core Design Contradiction:

ProductivityVSTemperature

Solution Approach 1:

The heat exchanger performs preliminary cooling action on the carrier gases before they reach the manifold. By cooling the gases in the intermediate section, the system prevents the hot gases from directly heating the manifold components, thus protecting the manifold while maintaining processing effectiveness.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The heat that would otherwise be harmful to the manifold is converted into a beneficial pre-heating of the carrier gases as they pass through the heat exchanger. The gases are heated to an optimal temperature for substrate processing, then cooled before reaching the manifold, thus utilizing the heat for productive purposes while preventing manifold overheating.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

2Reliability

If the manifold is protected from high temperature, then component durability is improved, but heat exchange capability with processing gases is reduced

Engineering Contradiction:

Improvemanifold component durabilityVSAvoidheat exchange capability

Core Design Contradiction:

ReliabilityVSUse of energy by moving object

Solution Approach 1:

The heat exchange function is moved from the manifold region to an intermediate vertical section. By placing the heat exchanger in the vertical space between the substrate retainer and manifold, the system separates the heat exchange function from the manifold support function, allowing the manifold to remain cool while heat exchange occurs in the intermediate section.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The heat exchanger acts as an intermediary that performs the heat exchange function away from the manifold. It captures heat from the carrier gases in the intermediate section, preventing this heat from reaching the manifold while still utilizing the thermal energy for process control.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively suppresses heat deterioration of the manifold components, maintaining them within a heat-resistant temperature range and ensuring stable substrate processing by cooling high-temperature gases before they reach the furnace port and insulating critical parts from excessive heat.

Implementation Method 1

a first heat exchanger installed in the process chamber to support the substrate retainer from a lower portion of the substrate retainer, and configured to perform a heat exchange with a gas flowing in a downward direction from a side of the substrate retainer in the process chamber

Methodology Applied

Scientific EffectHeat exchange: Heat Exchanger

Implementation Method 2

the first heat exchanger includes a hollow cylindrical insulating tube vertically extending in the downward direction and an insulating plate installed in the insulating tube

Methodology Applied

Scientific EffectThermal insulation: Thermal Insulation

Implementation Method 3

a lower insulating part installed under the first heat exchanger and made of a material having a thermal conductivity lower than that of the first heat exchanger

Methodology Applied

Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentUS9222732B2Substrate processing apparatus and method of manufacturing semiconductor device

Publication Date: 2015.12.29 KOKUSAI DENKI KK

AI summary

Provided is a substrate processing apparatus capable of maintaining a temperature of a furnace port part at a heat-resistant temperature or less of each member constituting the furnace part. The substrate processing apparatus includes a process chamber configured to process a plurality of substrates vertically stacked at predetermined intervals; a substrate retainer configured to hold the plurality of substrates in the process chamber; and a first heat exchanger installed in the process chamber to support the substrate retainer from a lower portion of the substrate retainer, and configured to perform a heat exchange with a gas flowing in a downward direction from a side of the substrate retainer in the process chamber, wherein the first heat exchanger includes a hollow cylindrical insulating tube vertically extending in the downward direction and an insulating plate installed in the insulating tube, and regions in the insulating tube over and under the insulating plate are spatially connected to each other.