Substrate Processing Apparatus Heating Chamber Transfer

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Solution Overview

Problem

Current substrate processing technologies in semiconductor manufacturing face challenges in improving throughput due to inefficiencies in heating and transferring substrates within the processing chamber.

Innovation Solution

A substrate processing apparatus is designed with a process chamber, a transfer chamber, and a heating chamber in communication, allowing for efficient transfer and heating of substrates using an elevator mechanism, and a controller to manage the heating and processing steps, optimizing the substrate processing sequence.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If substrates are heated in the process chamber before transfer, then substrate temperature is maintained consistent with processing conditions, but processing time increases and throughput decreases

Engineering Contradiction:

Improvesubstrate temperatureVSAvoidprocessing throughput

Core Design Contradiction:

TemperatureVSProductivity

Solution Approach 1:

The apparatus is divided into distinct functional chambers: a heating chamber for substrate heating, a transfer chamber for substrate transfer, and a process chamber for processing. This segmentation allows each chamber to perform its specific function independently, enabling substrate heating to occur in the heating chamber while the process chamber maintains processing conditions, thereby reducing total processing time and improving throughput.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The heating chamber pre-heats substrates to the required temperature before they are transferred to the process chamber. This preliminary heating action ensures that substrates arrive at the process chamber already at the optimal processing temperature, eliminating the need for additional heating time within the process chamber and thus improving overall processing efficiency and throughput.

Inventive Principle:

Principle #10Preliminary action

2Area of stationary object

If multiple substrates are vertically arranged in a single process chamber, then space utilization is improved, but heating uniformity and temperature consistency across substrates deteriorate

Engineering Contradiction:

Improvechamber space utilizationVSAvoidtemperature consistency

Core Design Contradiction:

Area of stationary objectVSStability of the object's composition

Solution Approach 1:

By separating the heating function into a dedicated heating chamber with individual substrate holders, each substrate can be heated uniformly and independently. The heating chamber is designed with heating elements positioned to ensure uniform temperature distribution across multiple substrates arranged vertically, maintaining temperature consistency while effectively utilizing chamber space.

Inventive Principle:

Principle #1Segmentation

3Measurement precision

If substrate transfer and heating are performed in separate steps, then process control precision is improved, but total processing time increases

Engineering Contradiction:

Improveprocess control precisionVSAvoidtotal processing time

Core Design Contradiction:

Measurement precisionVSLoss of time

Solution Approach 1:

The apparatus enables continuous substrate processing through an automated sequence: substrates are heated in the heating chamber, then automatically transferred to the process chamber without interruption. The elevator mechanism and transfer system operate continuously, eliminating idle time between heating and processing steps while maintaining precise temperature control, thus reducing total processing time without sacrificing process control precision.

Inventive Principle:

Principle #20Continuity of useful action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration significantly shortens the heating time of substrates and improves processing throughput by maintaining a consistent temperature and efficient substrate handling within the apparatus.

Implementation Method 1

a heating chamber in communication with a lower portion of the transfer chamber and configured to heat the substrate support and the substrate

Methodology Applied

Scientific EffectHeating: Heating

Data Source

PatentUS11538716B2Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium

Publication Date: 2022.12.27 KOKUSAI DENKI KK

AI summary

There is provided a technique that includes a process chamber configured to process a substrate; a transfer chamber in communication with a lower portion of the process chamber, and configured to transfer the substrate to a substrate support disposed in the process chamber, and a heating chamber in communication with a lower portion of the transfer chamber, and configured to heat the substrate support and the substrate.