Substrate Processing Idle Time Optimization
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Solution Overview
Problem
In semiconductor manufacturing, substrate processing apparatuses often experience idle time due to differences in plasma treatment times between machines, leading to unnecessary dummy treatments that decrease throughput and increase costs.
Innovation Solution
A method to calculate and set supplementary standby time based on predicted supply and completion times of substrate lots, determining if additional idle time is needed to avoid dummy treatments, thereby minimizing idle time and reducing the need for dummy wafers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If dummy treatment is performed to maintain processing chamber state, then treatment reliability is improved, but productivity decreases and costs increase
Solution Approach 1:
The system performs preliminary calculation of predicted standby time by comparing predicted supply time of the second lot with predicted completion time of the first lot. Based on this prediction, the system determines in advance whether dummy treatment is necessary, allowing proactive scheduling that prevents unnecessary dummy treatments while ensuring treatment reliability when needed.
Solution Approach 2:
The system dynamically adjusts substrate treatment time by adding supplementary standby time between treatments of unprocessed substrates in the first lot when predicted standby time exceeds a reference value. This dynamic time adjustment optimizes the balance between maintaining processing chamber state and maximizing throughput, reducing unnecessary dummy treatments.
2Reliability
If dummy treatment is performed to maintain processing chamber state, then treatment reliability is improved, but cost increases
Solution Approach 1:
The system calculates predicted standby time in advance by comparing the predicted supply time of the second lot with the predicted completion time of the first lot. This preliminary calculation allows the system to determine whether dummy treatment is truly necessary before committing resources, thereby avoiding unnecessary costs while ensuring treatment reliability when required.
Solution Approach 2:
The system dynamically adds supplementary standby time between treatments of unprocessed substrates when the predicted standby time exceeds a reference value. This dynamic adjustment reduces the frequency of dummy treatments by optimizing the utilization of the processing chamber, thereby reducing material costs associated with dummy wafers while maintaining treatment reliability.
3Productivity
If standby time is extended to avoid dummy treatment, then productivity is improved, but treatment reliability may worsen
Solution Approach 1:
The system dynamically adjusts substrate treatment time by adding supplementary standby time between treatments of unprocessed substrates in the first lot when predicted standby time exceeds a reference value. This dynamic time extension prevents unnecessary dummy treatments while ensuring that the processing chamber maintains suitable state for subsequent treatments, thereby balancing productivity improvement with treatment reliability.
Solution Approach 2:
The system uses feedback from the calculated predicted standby time to determine whether supplementary standby time should be added. By continuously monitoring and adjusting treatment time based on the predicted timing of the second lot supply, the system optimizes both productivity and treatment reliability, extending standby time only when necessary to avoid dummy treatments.
Data Source
AI summary
In a method for setting substrate-treatment time, substrate-treatment time is set by the following method. A predicted supply time of wafers of a following lot to a substrate processing apparatus is calculated based on a predicted plasma-treatment completion time of another substrate processing apparatus. A predicted plasma-treatment completion time of all of wafers of a present lot is calculated. A predicted idle time after the completion of the plasma treatment of all of the wafers of the present lot is calculated based on the predicted supply time of the following lot and the predicted plasma-treatment completion time of the present lot. If the predicted idle time is equal to or longer than the idle time required for dummy treatment, supplementary idle time is added between the plasma treatments of unprocessed wafers of the present lot.