Substrate Processing Apparatus Inert Gas Enclosure Oxygen Suppression
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In substrate processing for semiconductor devices, the incorporation of oxygen into process gases through connection points between the chamber and the gas supply system can affect processing results, and existing solutions like metal gaskets or double O-rings are not suitable for all configurations, particularly when using vaporizers with low vapor pressure raw materials.
Innovation Solution
A substrate processing apparatus is designed with an enclosure that surrounds the vaporizer and connection pipe, and an inert gas is supplied into this enclosure to prevent oxygen incorporation into the process gas, eliminating the need for metal gaskets or double O-rings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal gaskets or double O-rings are used to seal connection points, then oxygen incorporation is suppressed, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent applies the inert atmosphere principle by introducing a noble gas (such as nitrogen or argon) into the enclosure that houses the vaporizer and connection pipe. This creates an inert environment that prevents oxygen from reaching the connection points, thereby suppressing oxygen incorporation into the process gas without requiring complex metal gaskets or double O-ring sealing structures. The inert gas atmosphere acts as a protective barrier that eliminates the need for elaborate sealing mechanisms.
2Reliability
If metal gaskets or double O-rings are used to seal connection points, then oxygen incorporation is suppressed, but manufacturing cost increases
Solution Approach 1:
The patent applies the inert atmosphere principle by introducing a noble gas (such as nitrogen or argon) into the enclosure that houses the vaporizer and connection pipe. This creates an inert environment that prevents oxygen from reaching the connection points, thereby suppressing oxygen incorporation into the process gas without requiring complex metal gaskets or double O-ring sealing structures. The inert gas atmosphere acts as a protective barrier that eliminates the need for elaborate sealing mechanisms.
3Device complexity
If simple sealing methods are used, then device complexity is reduced, but oxygen incorporation occurs affecting processing results
Solution Approach 1:
The patent applies the inert atmosphere principle by introducing a noble gas (such as nitrogen or argon) into the enclosure that houses the vaporizer and connection pipe. This creates an inert environment that prevents oxygen from reaching the connection points, thereby suppressing oxygen incorporation into the process gas without requiring complex metal gaskets or double O-ring sealing structures. The inert gas atmosphere acts as a protective barrier that eliminates the need for elaborate sealing mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively suppresses oxygen incorporation into the process gas, ensuring consistent and reliable substrate processing results without the need for costly or impractical sealing solutions.
Implementation Method 1
an inert gas is supplied into this enclosure to prevent oxygen incorporation into the process gas
Data Source
AI summary
A substrate processing apparatus, includes: a chamber configured to be capable of being depressurized and accommodate a substrate; and an enclosure configured to enclose a supply source of a process gas supplied to the chamber and a connection pipe connecting the supply source and the chamber.