Substrate processing device
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Solution Overview
Problem
Existing substrate processing devices face challenges in enhancing productivity and reliability, particularly in the heat treatment and cooling processes of semiconductor substrates, which affect the overall efficiency and quality of semiconductor manufacturing.
Innovation Solution
The substrate processing device incorporates a heat treatment chamber with a heating chamber and a cooling chamber, connected by a substrate conveyance device, utilizing a heat exchanging element to control temperature through thermoelectric effects, ensuring precise temperature management and efficient substrate handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate heating and cooling systems are used, then temperature control reliability is improved, but device complexity increases
Solution Approach 1:
The patent combines the heating element and cooling element into a single integrated structure where the cooling element is positioned around the heating element. This merging allows both heating and cooling functions to be performed through one unified component system, reducing overall device complexity while maintaining the reliability of temperature control through coordinated operation of both elements.
Solution Approach 2:
The integrated heat exchange structure serves multiple functions: the heating element provides heating, the cooling element provides cooling, and together they form a unified temperature control system that can rapidly switch between heating and cooling modes. This multi-functionality reduces the need for separate independent systems while maintaining comprehensive temperature control capability.
2Productivity
If rapid temperature changes are implemented, then productivity is improved, but temperature uniformity deteriorates
Solution Approach 1:
The patent incorporates temperature sensors that continuously monitor the substrate temperature and provide feedback to the control system. This feedback mechanism allows the system to rapidly switch between heating and cooling modes while maintaining temperature uniformity by adjusting the operation of the heating and cooling elements based on real-time temperature measurements, thus achieving both high productivity and temperature precision.
Solution Approach 2:
The system dynamically switches between heating and cooling modes based on real-time temperature requirements. The heating element and cooling element can be activated or deactivated dynamically to achieve rapid temperature changes when needed, while the control system ensures temperature uniformity by adjusting the duration and intensity of heating/cooling cycles based on substrate temperature feedback.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances productivity and reliability by maintaining optimal temperature conditions for both heating and cooling processes, improving the quality and efficiency of semiconductor substrate processing.
Implementation Method 1
utilizing a heat exchanging element to control temperature through thermoelectric effects
Data Source
AI summary
A substrate processing device may include a process chamber configured to accommodate a substrate in space defined thereby; a heat treatment chamber configured to accommodate heat-treating of the substrate therein; and a substrate conveyance device configured to convey the substrate between the process chamber and the heat treatment chamber, wherein the heat treatment chamber comprises a heating chamber configured to heat the substrate in a space defined thereby; a cooling chamber configured to cool the substrate in a space defined thereby; and a heat exchanging element configured to heat the heating chamber and to cool the cooling chamber, the heat exchanging element in contact with the heating chamber and the cooling chamber.