Substrate Processing Device Inverted Orientation Vapor Management
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Solution Overview
Problem
Conventional single-wafer-type substrate processing devices face issues with process liquids spilling out and vapors adhering to the housing ceiling, leading to contamination and increased cleaning requirements, as they supply liquids from above the substrate, which can damage external devices and require time-consuming cleaning procedures.
Innovation Solution
A substrate processing device with a housing that holds the substrate with its processing surface directed to the bottom, incorporating a supply system for process liquids and vapors management, including an inlet for gases and an outlet for vapors, along with a guide member to direct vapors away from the ceiling, and heating means using infrared rays for efficient processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the processing surface of the substrate is directed upward and process liquid is supplied from above, then the process liquid can effectively peel thin films while flowing over the substrate, but the process liquid and its vapors spill out to the exterior of the housing and adhere to the ceiling surface
Solution Approach 1:
The patent inverts the conventional orientation by directing the processing surface of the substrate downward instead of upward. The process liquid is supplied from below the substrate, allowing it to flow upward over the processing surface. This inversion prevents the process liquid and its vapors from spilling out to the exterior and adhering to the ceiling surface, while still achieving effective thin film peeling through the flowing process liquid
Solution Approach 2:
The patent introduces a hood structure that covers the upper space of the substrate. This hood acts as a flexible barrier that contains the process liquid and vapors within the housing, preventing them from spilling out to the exterior. The hood can be designed to accommodate the substrate while maintaining containment of the process environment
2Device complexity
If the upper space of the substrate is left open to allow process liquid supply, then the device structure is simplified, but the process liquid and vapors spill out to the exterior and damage external devices
Solution Approach 1:
The patent introduces a hood structure that covers the upper space of the substrate. This hood acts as a flexible barrier that contains the process liquid and vapors within the housing, preventing them from spilling out to the exterior and damaging external devices. The hood is designed to accommodate the substrate while maintaining containment of the process environment
Solution Approach 2:
By inverting the substrate orientation and supplying process liquid from below, the patent reduces the need for complex overhead supply structures. The process liquid flows upward over the substrate surface, and the hood contains any potential spillage, simplifying the overall structure while protecting external devices
3Ease of operation
If the processing surface is directed upward for conventional process liquid supply, then the supply mechanism is straightforward, but cleaning and drying procedures become time-consuming due to process liquid adhesion to the ceiling
Solution Approach 1:
The patent inverts the conventional orientation by directing the processing surface downward and supplying process liquid from below. This inversion prevents process liquid from adhering to the ceiling surface, thereby eliminating the need for time-consuming cleaning and drying procedures while maintaining ease of operation in the liquid supply mechanism
Solution Approach 2:
The patent extracts the harmful effect of process liquid adhesion to the ceiling by changing the orientation and supply direction. The process liquid flows upward over the substrate and is contained within the housing by the hood, preventing it from reaching and adhering to the ceiling surface, thus eliminating the cleaning time requirement
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents process liquids and vapors from spilling or adhering to the exterior, reducing the need for cleaning and maintaining efficiency in substrate processing by ensuring vapors are evacuated, simplifying the device structure, and enhancing energy use through non-contact heating.
Implementation Method 1
heating means using infrared rays for efficient processing
Implementation Method 2
an inlet for taking in a gaseous body in the housing; and an outlet for evacuating, from the housing, vapors of the process liquid
Data Source
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AI summary
A single-wafer substrate processing device is provided which does not spill a processing liquid and the vapors thereof to an exterior when directly supplying the process liquid to a surface of a substrate to process the substrate and which prevents the process liquid and the vapors, etc., thereof to adhere a ceiling, etc., of a housing. The device includes a housing 1, holding means 4 that holds, in the housing 1, a substrate 3 subjected to an eliminating process of adhering materials on a processing surface with a processing surface 3a being directed to the bottom 1b of the housing, supply means that supplies a process liquid to the processing surface 3a of the substrate 3 held by the holding means 4, an inlet 1a for taking in a gaseous body in the housing 1, and an outlet 1c for evacuating from the housing the vapors of the process liquid in the housing 1 together with the gaseous body taken in from the inlet 1a.