Substrate Processing Apparatus LED Wavelength Shift Compensation
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in controlling the radiation amount of light sources, particularly with LEDs, due to peak wavelength variations and shifts caused by heat generation, leading to inefficiencies in light emission and suboptimal curing of curable compositions.
Innovation Solution
A substrate processing apparatus is designed with a controller that adjusts the radiation amount of light based on pre-measured spectral sensitivity characteristics of the composition, ensuring optimal curing by compensating for wavelength shifts and individual differences in LED peak wavelengths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If solid light sources such as LEDs are used instead of mercury lamps, then power consumption is reduced and service life is extended, but peak wavelength variations and shifts occur leading to suboptimal curing
Solution Approach 1:
The system incorporates a spectral sensitivity measurement unit that measures the actual spectral sensitivity characteristics of the curable composition in real-time, and a control unit that adjusts the radiation amount based on these measurements and the LED's actual peak wavelength, creating a closed-loop feedback system that maintains optimal curing despite wavelength variations
Solution Approach 2:
The system dynamically changes the radiation parameters (radiation amount and time) based on the measured spectral sensitivity characteristics and the LED's actual peak wavelength, rather than using fixed parameters, allowing optimal curing conditions to be maintained despite LED wavelength drift
2Reliability
If the radiation amount is increased to compensate for wavelength shifts, then curing completeness improves, but energy waste increases and over-curing may occur
Solution Approach 1:
The control unit uses feedback from the spectral sensitivity measurement unit to precisely calculate and adjust the radiation amount, ensuring that exactly the necessary energy is delivered for complete curing without excess, thereby avoiding energy waste and over-curing
Solution Approach 2:
The system dynamically adjusts the radiation parameters based on real-time measurements of the composition's spectral sensitivity and the LED's actual peak wavelength, rather than using static predetermined values, allowing precise energy delivery adapted to actual conditions
3Ease of operation
If spectral sensitivity characteristics from manufacturers are used, then process setup is simplified, but curing accuracy deteriorates due to film thickness changes over time
Solution Approach 1:
The system performs preliminary measurement of the actual spectral sensitivity characteristics of the curable composition using the spectral sensitivity measurement unit before the actual curing process, ensuring accurate curing parameters are established for the specific batch of composition being used
Solution Approach 2:
The system automatically measures and determines its own curing parameters using the spectral sensitivity measurement unit and control unit, eliminating the need to manually input or rely on manufacturer-provided spectral sensitivity data, thereby maintaining both ease of operation and curing accuracy
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves precise control over the radiation amount, leading to optimal curing of the composition, regardless of LED peak wavelength variations or shifts, thereby improving the efficiency and reliability of the substrate processing.
Implementation Method 1
a first radiation unit configured to radiate first light onto the substrate
Implementation Method 2
spectral sensitivity characteristics of the composition that are measured in advance
Data Source
AI summary
A substrate processing apparatus that can radiate light on a composition in an optimum radiation amount based on acquired spectral sensitivity characteristics can be provided.A substrate processing apparatus configured to perform pattern formation processing on a composition on a substrate includes a first radiation unit configured to radiate first light onto the substrate, a dispenser configured to apply the composition to a first position inside the substrate processing apparatus, a template holding unit configured to hold a template to be brought in contact with the composition on the substrate, and a controller configured to control a radiation amount of the first light to be radiated by the first radiation unit based on spectral sensitivity characteristics of the composition that are measured in advance.