Substrate Processing Liquid Pool Formation for Bubble Prevention
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Solution Overview
Problem
The challenge in substrate processing is to dry substrates without collapsing patterns and preventing bubbles from entering concave portions, which can lead to bubble marks and particle formation during the drying and polymer removal processes.
Innovation Solution
A method involving forming a liquid film on the substrate, replacing it with an organic solvent, and applying a filler solution to fill concave portions while rotating the substrate at controlled speeds to prevent bubble entrainment, using a substrate processing apparatus with specific units for rinsing, solvent, and filler solution supply, and control units to manage the process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a liquid film of rinsing liquid is formed on the pattern forming surface and then replaced with organic solvent, then the substrate can be dried without collapsing patterns, but bubbles may be entrained in the concave portions during the replacement process
Solution Approach 1:
A liquid pool of organic solvent is formed in advance near the center of rotation before the liquid film replacement process begins. This preliminary action ensures that when the rinsing liquid is replaced, the organic solvent is already positioned to prevent bubble formation and entrapment during the subsequent high-speed rotation and liquid film replacement.
Solution Approach 2:
The organic solvent acts as an intermediary substance between the rinsing liquid and the filler solution. By first replacing the rinsing liquid with organic solvent and allowing it to evaporate or be removed, a controlled environment is created that prevents bubble entrapment when the filler solution is subsequently applied to fill the concave portions.
2Object-affected harmful factors
If the substrate is rotated at high speed during liquid film replacement, then bubble entrapment is prevented, but the liquid pool formation becomes more complex
Solution Approach 1:
The substrate rotation speed is dynamically adjusted during the process. The substrate is rotated at a first rotational speed during the liquid pool formation step, then at a higher second rotational speed during the liquid film replacement step. This dynamic speed adjustment optimizes both the liquid pool formation and the replacement process while preventing bubble entrapment.
Solution Approach 2:
The liquid pool formation and replacement processes are performed in periodic sequence: first forming the liquid pool at a lower rotational speed, then increasing speed to replace the liquid film. This periodic action with varying rotational speeds achieves effective bubble prevention while managing process complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively fills concave portions with a filler while preventing bubble entrainment, enhancing substrate processing quality by maintaining pattern integrity and preventing bubble marks and particle formation.
Implementation Method 1
a liquid pool forming step of forming a liquid pool of an organic solvent by supplying the organic solvent to the liquid film near a center of rotation of the substrate
Implementation Method 2
replacing the rinsing liquid constituting the liquid film with the organic solvent by supplying the organic solvent to the liquid pool while rotating the substrate at a rotational speed higher than in the liquid pool forming step
Implementation Method 3
a filling step of causing a filler contained in the filler solution and applied to the pattern forming surface to sink and filling concave portions of the pattern with the filler
Data Source
AI summary
A substrate processing method comprises: a liquid film forming step of forming a liquid film of a rinsing liquid on a pattern forming surface of a substrate formed with a pattern; a liquid pool forming step of forming a liquid pool of an organic solvent by supplying the organic solvent to the liquid film near a center of rotation of the substrate; a replacement step of replacing the rinsing liquid constituting the liquid film with the organic solvent by supplying the organic solvent to the liquid pool while rotating the substrate at a rotational speed higher than in the liquid pool forming step; an application step of applying a filler solution to the pattern forming surface coated with the organic solvent; and a filling step of causing a filler contained in the filler solution and applied to the pattern forming surface to sink and filling concave portions of the pattern with the filler.