Substrate Processing Mixed Fluid Resist Removal
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Solution Overview
Problem
Conventional SPM processes for removing resist films from substrates can lead to contamination due to impurities in the water vapor used, which attach to the substrate during processing.
Innovation Solution
A substrate processing method that involves discharging a mixed fluid produced by mixing SPM liquid and purified water vapor or mist, which is used to efficiently remove resist films while preventing contamination by forming a liquid film on the substrate surface before introducing the mixed fluid, thereby avoiding direct attachment of impurities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If water vapor is used in the SPM process to remove resist films, then the processing efficiency is improved, but impurities in the water vapor attach to the substrate causing contamination
Solution Approach 1:
The patent introduces a liquid film as an intermediary layer between the water vapor and the substrate. This liquid film captures impurities from the water vapor before they can attach to the substrate, while still allowing the water vapor to provide its heating and processing benefits. The liquid film acts as a protective mediator that separates the harmful impurities from the substrate surface.
Solution Approach 2:
The patent applies preliminary action by forming a liquid film on the substrate surface before introducing the water vapor. This pre-formed liquid layer prepares the substrate to receive the water vapor treatment while already having protective capabilities against impurity attachment, preventing contamination before it occurs.
2Productivity
If conventional SPM process is used to remove resist films, then the processing speed is maintained, but contamination occurs due to impurity attachment
Solution Approach 1:
The liquid film serves as a mediator that preserves the fast processing speed of conventional SPM while filtering out impurities. It allows the beneficial effects of water vapor (heating, resist film softening) to reach the substrate efficiently, while simultaneously preventing impurity attachment that would compromise substrate cleanliness.
Solution Approach 2:
The patent converts the harmful effect of impurities in water vapor into a beneficial filtering mechanism. The impurities that would normally contaminate the substrate are instead captured by the liquid film, transforming what was a harmful contamination source into a protective filtration system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively removes resist films from substrates while reducing contamination risks by ensuring that impurities in the water vapor do not directly attach to the substrate, enhancing the efficiency and cleanliness of the SPM process.
Implementation Method 1
a mixed fluid discharge step of discharging a mixed fluid that is produced by mixing the processing liquid and a purified water in a vapor state or a mist state thereof
Data Source
AI summary
A substrate processing method includes discharging a processing liquid to a substrate, and discharging a mixed fluid that is produced by mixing a processing liquid and a purified water in a vapor state or a mist state thereof to a substrate where a processing liquid is discharged.