Substrate Processing Apparatus with Non-Contact Temperature Feedback

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

In semiconductor device manufacturing, microwave heat treatment of high-density substrates with complex patterns often results in non-uniform heating due to substrate deformation, leading to potential damage or breakage.

Innovation Solution

A substrate processing apparatus equipped with a process chamber, non-contact temperature measurement, and a controller that adjusts the heating device's output or power supply based on preset temperature limits to prevent substrate deformation, ensuring uniform heating within a specific temperature range.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If microwave heat treatment is applied to high-density substrates, then heating efficiency is improved, but substrate deformation occurs leading to non-uniform heating

Engineering Contradiction:

Improveheating efficiencyVSAvoidsubstrate uniformity

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The system employs a non-contact temperature measurement device to continuously monitor substrate temperature and feeds this information back to the controller. The controller adjusts the microwave heating output based on the measured temperature, creating a closed-loop control system that maintains uniform heating while preventing substrate deformation.

Inventive Principle:

Principle #23Feedback

Solution Approach 2:

The controller dynamically changes the microwave heating parameters (output power, heating duration) based on real-time temperature measurements. By adjusting these parameters according to the substrate's actual thermal state, the system achieves uniform heating without causing deformation or damage.

Inventive Principle:

Principle #35Parameter changes

2Productivity

If higher heating power is used to improve processing speed, then productivity increases, but substrate damage risk increases

Engineering Contradiction:

Improveprocessing speedVSAvoidsubstrate integrity

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The non-contact temperature measurement device provides real-time feedback on substrate temperature, enabling the controller to monitor thermal conditions continuously. This feedback mechanism allows the system to maintain high processing speeds while preventing temperature excursions that could cause substrate damage.

Inventive Principle:

Principle #23Feedback

Solution Approach 2:

The heating system transitions from static fixed-power heating to dynamic adaptive heating. The controller continuously adjusts the microwave output power based on real-time temperature measurements, optimizing the heating process to achieve both high speed and substrate safety.

Inventive Principle:

Principle #15Dynamics

3Measurement precision

If non-contact temperature measurement is implemented, then measurement accuracy is improved, but system complexity increases

Engineering Contradiction:

Improvetemperature measurement accuracyVSAvoidsystem complexity

Core Design Contradiction:

Measurement precisionVSDevice complexity

Solution Approach 1:

The system replaces contact-based temperature measurement methods with non-contact optical measurement. This substitution eliminates the need for physical probes that would contaminate or damage the substrate, providing accurate temperature data without mechanical interference.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively suppresses substrate deformation and damage by maintaining the substrate within a controlled temperature range, ensuring efficient and uniform heat treatment during the annealing process.

Implementation Method 1

at least one heating device configured to heat the at least one substrate using an electromagnetic wave

Methodology Applied

Scientific EffectElectromagnetic heating: Dielectric Heating

Implementation Method 2

a non-contact type temperature measurement device configured to measure a temperature of the at least one substrate

Methodology Applied

Scientific EffectNon-contact temperature measurement: Thermal Radiation

Data Source

PatentUS11265977B2Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium

Publication Date: 2022.03.01 KOKUSAI DENKI KK

AI summary

A process chamber configured to process at least one substrate; at least one heating device to heat the at least one substrate using an electromagnetic wave; a non-contact type temperature measurement device configured to measure a temperature of the at least one substrate; and a controller configured to acquire temperature data measured by the temperature measurement device, compare the measured temperature with a preset upper limit temperature and a preset lower limit temperature, lower an output of the at least one heating device or turn off a power supply of the at least one heating device when the measured temperature from the temperature data is higher than the upper limit temperature, and lower an output of the at least one heating device or turn off a power supply of the at least one heating device when the measured temperature from the temperature data is lower than the lower limit temperature.