Substrate Processing Apparatus Non-Recipe Operation Control
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Solution Overview
Problem
Current substrate processing apparatuses lack a flexible and easy method to set different conditioning operations for various processing modules, as existing methods are not adaptable to changing conditions and processes, leading to inefficiencies in operations like cleaning and leak checks.
Innovation Solution
A substrate processing apparatus with a controller and setting unit that allows for the flexible setting of non-recipe operations, including timing and content, for each processing module, enabling independent management of conditioning operations based on specific module needs and processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a fixed processing recipe is used for all processing modules, then the system is simple to operate, but it cannot adapt to different conditioning operation requirements of each module
Solution Approach 1:
The patent divides the processing system into multiple processing modules (PM1-PM4), each with independent conditioning operation settings. Each module can have its own cleaning, leak check, and other conditioning operations configured separately, allowing tailored conditioning for each module without affecting others.
Solution Approach 2:
The patent introduces dynamic timing selection for conditioning operations, allowing the system to automatically adjust when conditioning operations are performed based on process type, number of wafers, and module state. The controller dynamically determines optimal timing rather than using fixed schedules.
2Reliability
If conditioning operations are performed frequently to ensure module readiness, then reliability improves, but productivity decreases due to more downtime
Solution Approach 1:
The patent implements feedback mechanisms where the controller monitors the state of each processing module and adjusts conditioning operation timing accordingly. Conditioning operations are triggered based on actual module conditions, process requirements, and wafer counts, rather than following rigid predetermined schedules.
Solution Approach 2:
The patent allows changing of conditioning operation parameters (timing, frequency, type) based on process requirements. Different process types can specify different conditioning needs, and the system adjusts its behavior dynamically based on these parameter changes rather than maintaining fixed operation patterns.
3Manufacturing precision
If different conditioning operations are configured for each processing module, then operational precision improves, but the difficulty of setup and configuration increases
Solution Approach 1:
The patent creates a universal conditioning operation framework that can be applied to all processing modules through a common interface. The same basic conditioning operations (cleaning, leak check, etc.) are made universally applicable across different module types, reducing configuration complexity while maintaining precision.
Data Source
AI summary
The substrate processing apparatus includes: a plurality of processing modules; a transfer mechanism; a controller; and a setting unit. The processing module processes with respect to the substrate. The transfer mechanism transfers the substrate ejected from the transfer container. The controller outputs control signals for transferring the substrate to the plurality of processing modules along a previously set transfer path through the transfer mechanism sequentially, and for processing with respect to the substrate in the processing module of a transfer destination based on a processing recipe in which a processing order and a processing condition are set. The setting unit sets a content of a non-recipe operation except for operations set in the processing recipe and a performing timing for performing the non-recipe operation by a control operation of the controller every processing module. The non-recipe operation is performed with respect to the processing modules.