Substrate Processing Apparatus Nozzle Segmentation for Contamination Control
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Solution Overview
Problem
The wet etching process in semiconductor manufacturing contaminates processing containers and support units, leading to scattered cleaning solutions that contaminate other nozzles and generate electrostatic charges during cleaning.
Innovation Solution
A substrate processing apparatus and method that include a processing container, a support unit, and a liquid discharge unit with separate nozzles for treatment solutions, cleaning solutions, and antistatic liquids. The apparatus performs sequential operations for substrate processing, unloading, and container cleaning, with primary and secondary cleaning phases using pure water and carbon dioxide water, respectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If cleaning solution is discharged to clean the support unit and processing container, then the contamination from wet etching is removed, but the cleaning solution scatters in various directions and contaminates other nozzles
Solution Approach 1:
The cleaning process is divided into multiple stages with separate nozzles: a first nozzle for primary cleaning and a second nozzle for secondary cleaning. This segmentation allows the cleaning solution to be applied in controlled phases, preventing scattering and contamination of other nozzles while maintaining effective cleaning of the processing container.
2Reliability
If pure water is used for cleaning the processing container, then the cleaning effect is achieved, but electrostatic charge is generated during the cleaning process
Solution Approach 1:
The patent changes the electrical parameter of the cleaning solution by using deionized water instead of pure water. This parameter change maintains the cleaning effectiveness while eliminating the electrostatic charge generation problem, as deionized water does not generate static electricity during the cleaning process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively removes contamination sources from nozzles and facilitates the removal of electrostatic charges during the cleaning of support units and processing containers, improving the cleanliness and operational efficiency of the substrate processing system.
Implementation Method 1
the scattered cleaning solution is scattered to other nozzles along with particles, causing contamination of the nozzles. In addition, the solution used for cleaning the processing container is usually pure water, which generates static electricity when cleaning the support unit and the processing container
Data Source
AI summary
The apparatus includes a controller for controlling a liquid discharge unit and a support unit, in which the controller controls the support unit and the liquid discharge unit so that a substrate processing operation in which a treatment solution is supplied to the substrate to process the substrate; a substrate unloading operation in which the substrate is unloaded from the processing container after the substrate processing operation; and a container cleaning operation in which the processing container is cleaned after the substrate unloading operation are sequentially performed, and in the container cleaning operation, a primary cleaning is performed by discharging the cleaning solution from a first nozzle to the support unit, and then a secondary cleaning is performed by discharging the antistatic liquid from a second nozzle to the support unit or the processing container.