Substrate Processing Liquid Supply System with Radial Nozzles
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in achieving temperature and processing uniformity due to the gradual decrease in processing liquid temperature as it flows from the central to the peripheral edge of the substrate, leading to reduced processing efficiency and increased liquid consumption.
Innovation Solution
A substrate processing apparatus with a processing liquid supplying system that includes multiple discharge ports positioned at varying distances from the rotational axis, where the processing liquid is heated at different temperatures and supplied through branching flow passages to ensure uniform temperature distribution across the substrate, reducing liquid consumption while maintaining processing uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If the flow rate of the processing liquid discharged from the nozzle is increased, then the time taken for the processing liquid to reach the upper surface peripheral edge portion of the substrate is reduced, but the consumption amount of the processing liquid increases
Solution Approach 1:
The single discharge nozzle is divided into multiple nozzles (first nozzle for central portion, second nozzle for peripheral portion). Each nozzle discharges processing liquid at optimized flow rates for its specific region, reducing overall consumption while ensuring adequate supply to both central and peripheral areas.
Solution Approach 2:
Different regions of the substrate receive processing liquid with different characteristics: the central portion receives liquid from the first nozzle with higher temperature and lower flow rate, while the peripheral portion receives liquid from the second nozzle with lower temperature and higher flow rate. This local differentiation optimizes both processing uniformity and liquid consumption.
2Device complexity
If the processing liquid is discharged from a single nozzle toward the central portion of the substrate, then the structure is simple, but the temperature uniformity and processing uniformity across the substrate deteriorate
Solution Approach 1:
The discharge system is segmented into multiple nozzles positioned at different locations and orientations. The first nozzle discharges toward the central portion while the second nozzle discharges toward the peripheral portion, ensuring uniform temperature and processing across the entire substrate surface.
Solution Approach 2:
The processing liquid supply is extended from a single-point central discharge to a multi-point distributed discharge system. By adding the second nozzle at a position offset from the rotational axis and orienting it radially outward, the system achieves peripheral coverage that complements the central discharge, creating two-dimensional uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves enhanced temperature and processing uniformity across the substrate by stepwise temperature increase of the processing liquid, reducing liquid consumption and improving etching rates, especially at peripheral regions.
Implementation Method 1
a plurality of downstream heaters, wherein the plurality of downstream heaters heat the processing liquid supplied to the plurality of auxiliary upstream flow passages such that temperatures of the processing liquid supplied to a plurality of auxiliary downstream ends increase with increase of distance from the rotational axis
Implementation Method 2
a substrate holding unit rotating a substrate around a vertical rotational axis passing through a central portion of the substrate while holding the substrate horizontally
Data Source
AI summary
A supply flow passage branches into a plurality of upstream flow passages. The plurality of upstream flow passages include a branching upstream flow passage that branches into a plurality of downstream flow passages. A plurality of discharge ports are respectively disposed at a plurality of positions differing in distance from a rotational axis and discharge processing liquids, supplied via the plurality of upstream flow passages, toward an upper surface of a substrate held by a substrate holding unit.