Substrate Processing Nozzle for Uniform Multi-Substrate Gas Flow
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in uniformly processing the surfaces of multiple substrates due to non-uniform gas distribution and flow, leading to potential processing defects and inefficiencies.
Innovation Solution
A substrate processing apparatus with a nozzle design featuring gas introduction passages that allow partial fluid communication between them, combined with a gas guide structure that ensures symmetrical gas flow and uniform distribution across the substrate surfaces, along with a controller for precise gas supply and exhaust management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional gas supply methods are used, then gas is supplied to substrates, but gas distribution is non-uniform leading to poor processing uniformity
Solution Approach 1:
The gas supply system is segmented into multiple gas introduction passages (first, second, third, and fourth passages) arranged in a specific pattern. Each passage supplies gas to different regions of the substrate, allowing independent control and optimization of gas distribution to achieve uniform processing across the substrate surface.
Solution Approach 2:
The gas introduction passages are arranged asymmetrically with respect to the substrate center. The first and second passages are positioned at different distances from the substrate center compared to the third and fourth passages, creating an asymmetric configuration that compensates for natural gas flow patterns and achieves uniform gas distribution across the substrate surface.
2Productivity
If gas is supplied to multiple substrates simultaneously, then productivity increases, but gas mixing and particle generation increase
Solution Approach 1:
The gas supply system uses multiple separate gas introduction passages that deliver gas to different substrate regions independently. This segmentation prevents gas mixing between adjacent substrates, reducing particle generation while maintaining the ability to process multiple substrates simultaneously in a batch.
Solution Approach 2:
The nozzle structure acts as an intermediary device that distributes gas through controlled passages to each substrate position. This intermediary structure manages gas flow between multiple substrates, preventing direct gas mixing that would lead to particle generation while enabling simultaneous batch processing of multiple substrates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables uniform processing of substrate surfaces, reducing defects and ensuring consistent film formation across multiple substrates, while minimizing gas mixing and particle generation.
Implementation Method 1
a plurality of gas introduction passages configured to introduce the gas
Data Source
AI summary
There is provided a technique that includes: a process chamber in which at least one substrate is processed; at least one nozzle including a plurality of gas introduction passages configured to introduce a gas and a fluid communication portion configured to partially bring the plurality of gas introduction passages into fluid communication with each other; and a plurality of gas suppliers configured to supply the gas to the plurality of gas introduction passages.