Batch Substrate Processing Apparatus Plasma Discharge Segmentation
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Solution Overview
Problem
Batch type substrate processing apparatuses face issues with undesired thin film formation on inner walls due to process gases, leading to contamination and reduced efficiency, especially when plasma is generated, as these films are separated as particles by magnetic or electric fields, affecting the quality and efficiency of the substrate processing.
Innovation Solution
A batch type substrate processing apparatus with a separate discharge space for plasma generation, using a partition wall and multiple electrodes with RF power supply, where at least one electrode is outside and one inside the partition wall, and a gas supply pipe outside the partition wall to decompose process gases into radicals, which are then supplied to the processing space, reducing contamination and maintaining process efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If plasma is generated in the processing space using process gases, then substrate processing efficiency is improved, but undesired thin films are formed on inner walls causing contamination
Solution Approach 1:
The processing space is divided into two separate spaces by a partition wall: a discharge space for plasma generation and a processing space for substrate treatment. This segmentation allows plasma to be generated in the discharge space while preventing thin film formation on the processing space walls, thus resolving the contradiction between processing efficiency and contamination.
Solution Approach 2:
The harmful function of plasma generation (thin film deposition on walls) is extracted from the processing space and relocated to a separate discharge space. The beneficial function (substrate processing) remains in the processing space, achieving separation of harmful and useful effects.
2Productivity
If electrodes are disposed inside the processing space for plasma generation, then processing efficiency is improved, but damage to electrodes and partition wall increases
Solution Approach 1:
The electrodes are relocated to the discharge space separated from the processing space by the partition wall. This spatial segmentation protects the electrodes and partition wall from direct exposure to the harsh processing environment while maintaining plasma generation capability for efficient substrate processing.
Solution Approach 2:
The partition wall acts as an intermediary barrier between the discharge space (containing electrodes) and the processing space. This intermediary structure allows plasma to be generated efficiently while protecting the electrodes and partition wall from damage, resolving the contradiction between efficiency and durability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents the formation of particles on the inner walls by generating plasma in a separate space, maintaining the quality and efficiency of the substrate processing while reducing damage to the partition wall and electrodes.
Implementation Method 1
a discharge space in which plasma is generated
Implementation Method 2
a plurality of electrodes extending in the longitudinal direction of the tube and configured to generate plasma in the discharge space
Data Source
AI summary
Provided is a substrate processing apparatus. The substrate processing apparatus includes a tube configured to provide a processing space, a partition wall configured to provide a discharge space in which plasma is generated, a gas supply pipe configured to supply a process gas to the discharge space, and a plurality of electrodes configured to generate plasma in the discharge space. At least one of the plurality of electrodes is disposed outside the partition wall, and at least one of the plurality of electrodes is disposed inside the partition wall.