Substrate Processing Apparatus Purge Gas Deflection for Byproduct Adhesion
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Solution Overview
Problem
Conventional substrate processing apparatuses face challenges in suppressing the adhesion of reaction byproducts to the furnace opening, particularly due to temperature drops near cooling channels and the difficulty in preventing damage to guides with existing purge gas methods, which leads to particle generation and inadequate sealing.
Innovation Solution
A substrate processing apparatus with a cylindrical reaction tube, a manifold, and a lid configuration that includes a protection plate and a protection liner, where purge gas is introduced through specific gaps to decouple and deflect, effectively purging the inner surfaces and preventing byproduct adhesion, while maintaining the seal integrity and heat resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a cooling channel is installed in the furnace opening to maintain seal member temperature, then the seal member temperature is maintained within heat resistance range, but the temperature drop near the cooling channel causes reaction byproduct adhesion
Solution Approach 1:
The protection plate is divided into multiple segments (first protection plate and second protection plate) separated by a gap, allowing purge gas to flow through and create a protective atmosphere that prevents byproduct adhesion while maintaining cooling function
Solution Approach 2:
Purge gas is introduced as an intermediary substance between the reaction byproducts and the furnace opening inner surface, creating a protective gas barrier that prevents adhesion without interfering with the cooling channel's temperature control function
2Object-generated harmful factors
If a guide is installed parallel to the furnace opening inner surface to suppress byproduct adhesion, then byproduct adhesion is reduced, but the guide is damaged due to contact with the furnace opening
Solution Approach 1:
The protection plate is designed as a replaceable component that can be easily replaced when worn or damaged, rather than attempting to make the guide durable through complex protective measures
Solution Approach 2:
Purge gas serves as an intermediary that protects the protection plate from direct contact with reaction byproducts, eliminating the need for physical contact and thus preventing damage
3Object-generated harmful factors
If purge gas is supplied to a guide to prevent byproduct adhesion, then adhesion is suppressed, but the guide must have a large gap from the furnace opening which reduces effectiveness
Solution Approach 1:
The protection plate is segmented into multiple sections with gaps between them, allowing purge gas to flow through multiple pathways and effectively cover the entire furnace opening inner surface area
Solution Approach 2:
The protection plate extends into the furnace opening space, creating a three-dimensional protective barrier that enhances the effectiveness of purge gas distribution across the inner surface
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces the adhesion of reaction byproducts to the inner walls, minimizes particle generation, and enhances the productivity by maintaining the heat resistance and integrity of the seal members, thereby improving the film-formation quality and process efficiency.
Implementation Method 1
a cooling channel in the furnace opening and circulating cooling water in the cooling channel
Implementation Method 2
supplying purge gas to a guide and allowing the purge gas to flow through the inner surface of the furnace opening
Implementation Method 3
a heater may be installed in the furnace opening
Data Source
AI summary
There is provided a technique that includes a substrate processing apparatus, comprising a process chamber having a cylindrical space configured to accommodate a substrate; and a plurality of nozzles communicating with a gas supply pipe and discharging processing gas in the process chamber, the process chamber includes a cylindrical reaction tube; a cylindrical manifold; and a lid, the lid includes a protection plate; and an introduction hole, the manifold includes a protection liner on an inner face of the manifold such that a second gap is formed between the manifold and the protection liner, the first gap being formed to allow the purge gas flowing toward the manifold to be deflected by the inner face of the manifold and to flow into the second gap.