Substrate Processing Apparatus for Resist Film Removal
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Solution Overview
Problem
In semiconductor device manufacturing, there is a challenge in effectively removing adhered substances such as resist films or hard mask films from substrates after etching processes, as existing methods are inefficient in completely removing these substances without damaging the substrate.
Innovation Solution
A substrate processing apparatus and method that uses a processing liquid containing a removing agent and a solvent with a boiling point lower than the removing agent, combined with a thickener, to form a film on the adhered substance, heat the substrate to promote evaporation and reaction, and then rinse with a rinsing liquid to remove the adhered substance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a removal liquid is supplied to the substrate to remove adhered substance, then the adhered substance can be removed, but the removal process takes a long time and may damage the substrate
Solution Approach 1:
The patent changes the temperature parameter of the substrate during the removal process. By heating the substrate to a predetermined temperature, the removal liquid works more effectively and faster, improving productivity while the controlled temperature ensures substrate safety.
Solution Approach 2:
The patent applies preliminary action by heating the substrate before supplying the removal liquid. This pre-heating prepares the substrate and removal liquid for more effective interaction, enabling faster removal while reducing the time the substrate is exposed to potentially damaging chemicals.
2Productivity
If the substrate is heated to promote evaporation and reaction, then the removal efficiency is improved, but the temperature control must be precise to avoid substrate damage
Solution Approach 1:
The patent optimizes the temperature parameter within a specific range (predetermined temperature that promotes evaporation but remains below substrate damage threshold). This controlled parameter change achieves high removal efficiency while maintaining substrate integrity.
Solution Approach 2:
The patent implements feedback control by monitoring the substrate temperature and adjusting heating to maintain the predetermined temperature. This ensures the temperature is high enough for efficient removal but low enough to prevent substrate damage.
3Reliability
If a processing liquid containing solvent and removing agent is used, then the removal effectiveness is improved, but the complexity of the processing system increases
Solution Approach 1:
The patent uses a composite processing liquid containing both solvent and removing agent. This composite formulation enhances removal effectiveness by combining the functions of different chemicals, while the liquid phase simplifies application compared to multi-step processes.
Solution Approach 2:
The patent merges the functions of solvent and removing agent into a single processing liquid that can be applied in one step. This consolidation improves removal effectiveness while reducing system complexity by eliminating the need for separate application steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively removes adhered substances from substrates by promoting evaporation and reaction with the removing agent, ensuring thorough removal while minimizing substrate damage.
Implementation Method 1
the substrate heating unit subsequently heats the substrate at the predetermined temperature so as to promote evaporation of the solvent
Implementation Method 2
reaction of the adhered substance with the removing agent
Data Source
AI summary
The present disclosure relates to a processing liquid supplying unit configured to supply a processing liquid that contains a removing agent of an adhered substance and a solvent having a boiling point lower than a boiling point of the removing agent to a substrate, a substrate heating unit configured to subsequently heat the substrate at a predetermined temperature that is equal to or higher than the boiling point of the solvent in the processing liquid and is lower than the boiling point of the removing agent, and a rinsing liquid supplying unit configured to subsequently supply a rinsing liquid to the substrate so as to remove the adhered substance from the substrate.