Substrate Processing Rotary Table Speed Control
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Solution Overview
Problem
Current substrate processing methods for semiconductor devices face challenges in achieving uniform chemical liquid processing and efficient liquid film management, leading to suboptimal reaction uniformity and chemical liquid consumption.
Innovation Solution
A substrate processing method utilizing a rotary table with an electric heater and processing nozzles to form and heat a chemical liquid film on the substrate, involving sequential speed control and rocking motion to enhance reaction uniformity and reduce chemical liquid usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the rotary table is rotated at a high speed to form a thin liquid film, then the chemical processing uniformity is improved, but the reaction efficiency between chemical liquid and substrate surface is reduced
Solution Approach 1:
The rotary table speed is dynamically adjusted through multiple stages: initially rotating at a first speed to form a liquid film, then rotating at a second speed to form a thicker liquid film, and finally rotating at a third speed (equal to or lower than the second speed) during heating to maximize reaction efficiency. This dynamic speed adjustment resolves the contradiction between processing uniformity and reaction efficiency.
Solution Approach 2:
The processing is divided into periodic stages with different rotation speeds: a first period at high speed for liquid film formation, a second period at medium speed for thick liquid film formation, and a third period at low speed for heating and reaction. This periodic action allows the system to achieve both uniformity and efficiency at different time points.
2Productivity
If the rotary table is rotated at a low speed to form a thick liquid film, then the reaction efficiency is improved, but the chemical processing uniformity deteriorates
Solution Approach 1:
A thin liquid film is formed first by rotating the rotary table at a first speed, ensuring uniform distribution of chemical liquid across the substrate surface. Subsequently, the table is rotated at a second speed to form a thicker liquid film for enhanced reaction efficiency. This preliminary action of forming a thin film first ensures that even at lower speeds, processing uniformity is maintained.
3Productivity
If the chemical liquid is heated while rotating at a high speed, then the reaction efficiency is improved, but the liquid film becomes unstable and reaction uniformity deteriorates
Solution Approach 1:
The rotation speed parameter is changed to a third speed (equal to or lower than the second speed) specifically during the heating phase. This parameter change stabilizes the liquid film during heating, preventing instability while maintaining reaction efficiency through the previously formed thick liquid film. The temperature parameter is simultaneously increased to enhance reaction efficiency without compromising uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method improves the uniformity of chemical processing on semiconductor substrates while minimizing chemical liquid consumption, achieving better reaction consistency and efficiency.
Implementation Method 1
an electric heater provided in the rotary table to be rotated along with the rotary table and configured to heat the substrate placed on the rotary table
Implementation Method 2
forming, by supplying a chemical liquid as the processing liquid onto a central portion of the substrate while rotating the rotary table at a first speed, a liquid film of the chemical liquid having a first thickness on an entirety of the front surface of the substrate
Data Source
AI summary
A substrate processing method includes forming, by supplying a chemical liquid onto a central portion of a substrate while rotating a rotary table at a first speed, a liquid film of the chemical liquid having a first thickness; forming, by supplying the chemical liquid onto the central portion while rotating the rotary table at a second speed lower than the first speed after the forming of the liquid film having the first thickness, a liquid film of the chemical liquid having a second thickness larger than the first thickness; and heating, by heating the rotary table in a state that the rotary table is rotated at a third speed lower than the second speed or in a state that the rotating of the rotary table is stopped after the forming of the liquid film having the second thickness, the substrate and the liquid film of the chemical liquid.