Substrate Processing Apparatus Temperature Measurement

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Solution Overview

Problem

Existing substrate processing apparatuses face challenges in maintaining uniformity of substrate quality due to inaccuracies in temperature distribution measurement during processing, as they rely on pre-measured data that may differ significantly from actual conditions during the process.

Innovation Solution

The apparatus includes a measurement unit positioned apart from the gas injecting unit, capable of measuring the substrate's temperature in a way that minimizes interference, allowing for real-time temperature distribution monitoring and adjustment during processing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If temperature measurement is performed before processing using thermocouple wafer, then temperature distribution data is obtained for process planning, but the measured temperature distribution differs significantly from actual temperature during processing due to variable changes

Engineering Contradiction:
Improvetemperature distribution measurement accuracyVSAvoiduniformity of substrate quality
Core Design Contradiction:
Measurement precisionVSReliability

Solution Approach 1:

The measurement unit is positioned to measure temperature at locations that reflect actual processing conditions before the process begins, allowing predictive temperature distribution mapping that accounts for variable changes during processing. This preliminary measurement at strategic locations enables more accurate prediction of actual temperature distribution during processing.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The system uses measured temperature data from the measurement unit to continuously monitor and adjust processing parameters, creating a feedback loop that compensates for temperature variations. This feedback mechanism allows real-time correction of temperature distribution deviations, improving both measurement accuracy and substrate quality uniformity.

Inventive Principle:
Principle #23Feedback

2Measurement precision

If measurement unit is positioned to avoid interference with gas injecting unit, then accurate temperature measurement is enabled, but measurement position must be optimized to capture representative temperature data

Engineering Contradiction:
Improvetemperature measurement accuracyVSAvoidmeasurement unit positioning complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The measurement unit is positioned at specific local locations where temperature is most representative of overall substrate conditions. Rather than attempting to measure everywhere, the system identifies critical measurement zones that provide the most valuable temperature data for process control, simplifying the overall measurement system while maintaining accuracy.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The measurement unit measures temperature in a dimension or location that is complementary to the gas injection paths. By positioning the measurement unit to capture temperature gradients in specific spatial dimensions, the system obtains comprehensive temperature distribution data without interfering with the vertical gas injection process.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances the uniformity and stability of the processing outcome by providing accurate temperature data in real-time, enabling better control over the processing conditions.

Implementation Method 1

a measurement unit measuring a temperature of a substrate supported by the substrate supporting unit or a temperature of the substrate supporting unit at a measurement position apart from the diameter direction

Methodology Applied
Scientific EffectThermal radiation detection: Thermal Radiation

Data Source

PatentUS20220392790A1Substrate processing apparatus and spray module of substrate processing apparatus
Publication Date: 2022.12.08 JUSUNG ENG
  • US20220392790A1 patent drawing
  • US20220392790A1 patent drawing
  • US20220392790A1 patent drawing

AI summary

The present inventive concept relates to a substrate processing apparatus and a spray module of the substrate processing apparatus, the substrate processing apparatus comprising: a chamber for providing a processing space; a lid for covering the upper portion of the chamber; a substrate support portion which supports at least one substrate and rotates about a rotary shaft; a gas spray portion which is above the substrate support portion in a diameter direction from the rotary shaft of the substrate support portion and which sprays a processing gas; and a measuring portion which is arranged to be in parallel with or to be inclined in a direction at a certain angle with respect to the diameter direction on a measurement position that is spaced apart from the diameter direction and which measures the temperature of the substrate supported by the substrate support portion or the temperature of the substrate support portion.