Substrate Processing Apparatus Thermal Deformation Compensation
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Solution Overview
Problem
In high-temperature substrate processing, thermal deformation and vacuum forces cause misalignment of components in substrate processing apparatuses, leading to non-uniform thin film deposition and reduced process uniformity, as well as increased defect rates in semiconductor devices.
Innovation Solution
A substrate processing apparatus with a position control unit and support unit that maintain a constant gap between the gas supply unit and substrate mounting unit, allowing for fine adjustments and compensation movements to correct for thermal deformation without stopping the process, using a combination of vertical and horizontal position control units and elastic members to prevent over-constraint and ensure precise alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If rigid fixed support is used to maintain component positions, then structural stability is improved, but thermal deformation causes misalignment and loss of symmetry under high temperature
Solution Approach 1:
The support unit is designed to be movable rather than rigidly fixed, allowing it to dynamically adjust its position in response to thermal deformation. The movable support unit can shift to compensate for expansion of the reaction chamber body, maintaining proper alignment between the gas supply unit and substrate support unit even under high temperature conditions.
Solution Approach 2:
The system changes the physical state of the support unit from fixed to movable, enabling it to respond to temperature-induced dimensional changes. By allowing positional parameter changes in the support unit, the system maintains alignment precision despite thermal expansion of other components.
2Manufacturing precision
If multiple position control units are used to maintain alignment, then alignment precision is improved, but device complexity increases
Solution Approach 1:
The position control function is segmented into multiple independent control units distributed at different locations. Each control unit independently adjusts the position of the support unit at its location, allowing localized compensation for thermal deformation without requiring a complex centralized control system.
Solution Approach 2:
The support unit serves multiple functions: it supports the gas supply unit, allows positional adjustment through multiple control units, and compensates for thermal deformation. This multi-functionality reduces the need for separate compensation mechanisms, thereby controlling overall system complexity.
3Stability of the object's composition
If the support unit is fully constrained to prevent movement, then positional stability is improved, but thermal expansion causes internal stress and potential damage
Solution Approach 1:
The support unit is designed with controlled movability rather than full constraint. It can move within certain limits to accommodate thermal expansion, preventing buildup of internal stress while maintaining sufficient positional stability for proper alignment during operation.
Solution Approach 2:
The movable support design anticipates thermal expansion by providing built-in compliance. This allows the system to absorb thermal stress through controlled movement of the support unit, preventing damage before it occurs rather than relying on post-failure repairs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution maintains process uniformity and reduces defect rates by ensuring consistent gap widths and alignment between components, even under high-temperature and vacuum conditions, thereby improving the efficiency and reproducibility of substrate processing without the need for frequent maintenance.
Implementation Method 1
the support unit may include an elastic member configured to generate an elastic force that changes according to the movement of the second plate
Data Source
AI summary
A substrate processing apparatus capable of solving a misalignment problem of chamber portions due to thermal deformation or a vacuum force during high-temperature processing includes a first plate; a second plate on the first plate; a position control unit configured to change a relative position of the second plate with respect to the first plate; and a support unit configured to permit movement of the second plate while supporting the second plate.