Substrate Processing Apparatus with Constant Interprocess Time Control
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Solution Overview
Problem
The existing substrate processing methods, particularly those using chemically amplified resists, face challenges in achieving uniform line width due to variations in processing conditions, especially the time interval between exposure and post-exposure bake processes, which are not adequately controlled, leading to inconsistencies in pattern formation.
Innovation Solution
A substrate processing apparatus is designed with a cleaning and heating processing part, along with a transport mechanism and controller to maintain constant interprocess time intervals between exposure, cleaning, and heating processes, ensuring uniform processing history and improved line width uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the time interval between exposure and post-exposure bake processes is not controlled, then the processing is simpler, but line width uniformity deteriorates
Solution Approach 1:
The controller receives information about the completion of the exposure process and uses this feedback to automatically start the post-exposure bake process at the appropriate time, ensuring constant time interval control without manual intervention
Solution Approach 2:
The system prepares the substrate in advance by performing the cleaning process and positioning it in the heating processing part ready for the post-exposure bake process, so that when the exposure process completes, the substrate is immediately ready for heating with the predetermined time interval already established
2Manufacturing precision
If the time interval between cleaning and post-exposure bake processes is not controlled, then the cleaning process is simpler, but line width uniformity deteriorates
Solution Approach 1:
The controller receives information about the completion of the cleaning process and uses this feedback to automatically start the post-exposure bake process at the appropriate time, ensuring constant time interval control without manual intervention
Solution Approach 2:
The system performs the cleaning process in advance and positions the substrate in the heating processing part ready for the post-exposure bake process, so that when cleaning completes, the substrate is immediately ready for heating with the predetermined time interval already established
3Manufacturing precision
If multiple processing steps are performed with controlled time intervals, then line width uniformity improves, but processing time increases
Solution Approach 1:
The substrate is continuously transported through the cleaning processing part and then positioned in the heating processing part without interruption, maintaining continuous useful action throughout the process sequence
Solution Approach 2:
The cleaning process and substrate positioning are performed in advance during the exposure process time interval, so that when exposure completes, the substrate is already ready for immediate heating, effectively utilizing otherwise idle time
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves improved line width uniformity by maintaining consistent time intervals between exposure and post-exposure bake processes, and between cleaning and heating processes, enhancing the reliability and consistency of pattern formation.
Implementation Method 1
a cleaning processing part for performing at least a cleaning process on a substrate subjected to an exposure process
Implementation Method 2
a heating processing part for performing a heating process on a substrate subjected to the cleaning process
Implementation Method 3
a transport mechanism for receiving a substrate from the exposure apparatus to transport the substrate through the cleaning processing part to the heating processing part
Implementation Method 4
a controller for providing an approximately constant first interprocess time interval between the instant at which the exposure apparatus completes the exposure process of a substrate and the instant at which the heating processing part starts the heating process of the substrate, and for providing an approximately constant second interprocess time interval between the instant at which the cleaning processing part completes the cleaning process of the substrate and the instant at which the heating processing part starts the heating process of the substrate
Data Source
AI summary
A method of processing a substrate subjected to an exposure process includes the steps of: transporting a substrate subjected to the exposure process to a cleaning processing part and performing a cleaning process in said cleaning processing part on said substrate subjected to the exposure process. The method also includes the steps of transporting said substrate subjected to the cleaning process from said cleaning processing part to a heating processing part and performing a heating process in said heating processing part on said substrate subjected to the cleaning process. A first interprocess time interval between the instant at which the exposure process of a substrate is completed and the instant at which the heating process of the substrate is started is made approximately constant, and a second interprocess time interval between the instant at which the cleaning process of the substrate is completed and the instant at which the heating process of the substrate is started is made approximately constant.