Substrate Processing Method for Uniform Chamber Control
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Solution Overview
Problem
Wafer processing in multiple chambers often results in performance differences due to changing internal conditions, leading to non-uniform processing outcomes despite adjustments in recipe and adjustment parameters, especially in cluster-type substrate processing systems where the specific processing chamber for each wafer is not specified.
Innovation Solution
A substrate processing method that adjusts apparatus parameters for each processing chamber based on estimated models of sensor data from initial test substrates, ensuring deviations from ideal sensor values are within an allowable range, allowing continuous loading of product substrates across multiple chambers without specifying the chamber, and adjusting sensor data input/output accordingly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the same processing recipe is applied to multiple processing chambers, then productivity is improved through parallel processing, but manufacturing precision deteriorates due to performance differences between chambers
Solution Approach 1:
The patent applies local quality by creating chamber-specific adjustment parameters that customize the processing conditions for each individual processing chamber. Instead of using a single universal recipe, the system generates tailored adjustment parameters for each chamber based on its specific characteristics and sensor data, thereby maintaining processing uniformity across multiple chambers while preserving the benefits of parallel processing.
Solution Approach 2:
The patent implements parameter changes by dynamically adjusting processing parameters based on sensor data collected from each processing chamber. The system modifies recipe parameters according to chamber-specific conditions and performance variations, allowing each chamber to operate at optimal settings that compensate for individual differences and maintain consistent processing results across all chambers.
2Ease of operation
If processing chambers are used without specification, then ease of operation is improved through flexible loading, but manufacturing precision deteriorates due to chamber variability
Solution Approach 1:
The patent applies feedback by continuously monitoring sensor data from each processing chamber and using this information to adjust processing parameters. The system collects real-time data on chamber conditions and performance, then feeds this information back to modify adjustment parameters for subsequent processing runs, ensuring consistent results even when chambers are loaded flexibly without pre-specified assignment.
Solution Approach 2:
The patent implements preliminary action by pre-adjusting processing parameters for each chamber based on initial sensor data collection and characterization. Before normal flexible loading operations begin, the system performs preliminary measurements and creates chamber-specific adjustment profiles, enabling subsequent ease of operation with pre-established parameters that compensate for individual chamber variations.
3Manufacturing precision
If recipe parameters are adjusted to compensate for chamber differences, then manufacturing precision is improved, but device complexity increases due to multiple adjustment parameters
Solution Approach 1:
The patent applies universality by creating a unified adjustment parameter system that works across all processing chambers through a common methodology. Although chamber-specific parameters are generated, they all follow the same adjustment framework and are managed through a single control system that handles multiple chambers uniformly, reducing the perceived complexity despite the multi-chamber nature of the system.
Solution Approach 2:
The patent implements self-service by enabling the processing system to automatically generate and adjust parameters based on its own sensor data without requiring external intervention. The system autonomously characterizes each chamber, creates adjustment parameters, and modifies recipes as needed, reducing the operational complexity of managing multiple parameters through automated self-adjustment capabilities.
Data Source
AI summary
Provided is a substrate processing method including: referring to a memory unit in which an estimated model of sensor data generated from sensor data input to or output from each of the processing chamber when processing first test substrates are processed in the processing chambers under a same processing condition; adjusting an apparatus parameter of each of the processing chambers such that a deviation of the sensor data from an ideal sensor value is within an allowable range; loading product substrates continuously into the processing chambers without specifying a loading destination processing chamber; and, when the product substrate is loaded into a processing chamber of the processing chambers, adjusting the sensor data input to or output from the processing chamber into which the product substrate has been loaded based on the apparatus parameter of the processing chamber that has been adjusted in the adjusting; and processing the product substrate.