Substrate Processing Method for Inter-Plane Uniformity
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Solution Overview
Problem
Batch type substrate processing apparatuses face challenges in achieving inter-plane uniformity during semiconductor wafer processing, particularly when a small number of monitor substrates are used, leading to increased manufacturing costs and difficulties in optimizing processing conditions.
Innovation Solution
A substrate processing method that involves acquiring processing conditions and results using a small number of monitor substrates, calculating processing condition differences, and determining results at unmonitored slot positions based on a process model, allowing for optimization of processing conditions to improve inter-plane uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of substance
If a small number of monitor substrates are used in batch type substrate processing, then manufacturing costs are reduced, but it becomes difficult to ensure inter-plane uniformity and optimize processing conditions
Solution Approach 1:
The patent creates a virtual copy of the monitor substrate data by calculating processing results at unmonitored slot positions based on measured data from monitored positions. The process model generates estimated processing results for slots without substrates, effectively copying the monitoring function to positions where no physical monitor substrate is present, thereby maintaining inter-plane uniformity assessment with fewer monitor substrates
Solution Approach 2:
The patent replaces the physical mechanical system of placing monitor substrates in all slots with a computational system. Instead of using physical monitor substrates at every position, the system uses measurement data from fewer monitor substrates combined with a process model to calculate and predict processing results at all positions, substituting computational analysis for physical monitoring
2Measurement precision
If multiple monitor substrates are arranged at all slot positions, then processing results can be directly measured, but manufacturing costs increase due to higher monitor substrate consumption
Solution Approach 1:
The system creates virtual measurement data for unmonitored positions by calculating processing results based on the process model and data from monitored positions. This copying approach allows the system to obtain measurement information at all slot positions without physically placing monitor substrates at every position, thereby reducing monitor substrate consumption while maintaining measurement precision
Solution Approach 2:
The process model acts as an intermediary between the measured data from monitor substrates and the processing results at unmonitored positions. Instead of directly measuring all positions with monitor substrates, the process model mediates by calculating and predicting processing results at unmonitored slots based on the relationship established from monitored positions, reducing the need for physical monitor substrates
3Reliability
If monitor substrates are placed at all slot positions, then processing conditions can be directly monitored, but the complexity of substrate arrangement and data management increases
Solution Approach 1:
The patent extracts the essential monitoring function from the physical monitor substrates and concentrates it into a smaller number of strategically placed monitor substrates. By taking out the monitoring function from every slot and concentrating it in fewer positions, combined with computational calculation for other positions, the system reduces substrate arrangement complexity while maintaining reliable processing condition monitoring
Solution Approach 2:
The process model serves as a universal tool that can predict processing results at any unmonitored slot position based on data from monitored positions. This multi-functional approach allows the same process model to handle calculations for all unmonitored positions, reducing the need for individual monitor substrates at each position while maintaining comprehensive monitoring capability
Data Source
AI summary
Disclosed is a substrate processing method. The substrate processing method includes: a first acquisition step of acquiring a first processing condition in a first processing performed using a first number of monitor substrates and a first processing result related to the monitor substrates; a second acquisition step of acquiring a second processing condition in a second processing performed using a second number of monitor substrates and a second processing result related to the monitor substrates; a first calculation step of calculating a processing condition difference between the first processing condition and the second processing condition; and a second calculation step of calculating a processing result of substrates at slot positions where no monitor substrate is placed in the first processing, based on the first processing result, the second processing result, the processing condition difference, and a process model representing a relationship between a processing condition and a processing result.