Electronic Device Substrate Protruding Support Structure
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Solution Overview
Problem
Conventional methods for securing electronic components to a chassis restrict miniaturization due to the need for screws at central portions, which limits the placement of components and increases the risk of contact between components and the chassis during substrate warping.
Innovation Solution
An electronic device design featuring a substrate with a gap between its primary surface and a chassis, supported by a protruding portion that prevents contact between the substrate and the chassis, allowing components to be mounted on the entire surface except where the protruding portion is located, thereby maintaining clearance and enabling miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If screws are inserted through the central portion of the substrate to prevent contact with the chassis, then reliability is improved, but the mounting surface area is reduced
Solution Approach 1:
The invention transitions from a two-dimensional planar support approach to a three-dimensional approach by introducing a protruding portion that extends vertically from the chassis toward the substrate. This vertical dimension allows the support structure to occupy space that would otherwise be available for component mounting, resolving the contradiction by using the gap dimension rather than consuming mounting surface area.
Solution Approach 2:
The protruding portion acts as an intermediary element between the chassis and the substrate. Instead of directly fixing the substrate to the chassis with screws that occupy mounting space, the protruding portion mediates the support function by extending into the gap and providing structural reinforcement without consuming valuable mounting surface area on the substrate.
2Volume of moving object
If the gap between the substrate and chassis is reduced to enable miniaturization, then the device size is reduced, but the risk of electronic component contact with the chassis increases
Solution Approach 1:
The protruding portion is strategically positioned at specific locations where it provides localized support and reinforcement. This local quality approach allows the gap to be reduced in certain areas for miniaturization while maintaining adequate clearance in other areas through the targeted presence of the protruding portion, which prevents substrate warping from causing component contact with the chassis.
Solution Approach 2:
The protruding portion is pre-positioned in the gap before the substrate is fully assembled, creating a preliminary support structure that maintains the necessary clearance. This preliminary action ensures that even when the overall device size is reduced and the gap is smaller, the protruding portion is already in place to prevent warping-induced contact between electronic components and the chassis.
3Stability of the object's composition
If screws are used to fix the substrate at corner portions and central portion, then structural stability is improved, but the device complexity increases
Solution Approach 1:
The invention extracts the support function from the traditional screw-fastening system and relocates it to the protruding portion integrated into the chassis. By taking out the need for multiple discrete fastening components and replacing them with a single integrated protruding structure, the device complexity is reduced while maintaining the necessary structural stability through the protruding portion's support at critical locations.
Data Source
AI summary
An ECU includes a substrate and a chassis. Electronic components are mounted on a first primary surface of the substrate. The chassis includes a protruding portion that protrudes toward a position different from where the electronic components are. A height of the protruding portion is greater than a height of the electronic components, and shorter than a gap between the substrate and the heat sink. When warping occurs in the substrate and the first primary surface approaches an opposing surface of the heat sink, the protruding portion contacts the first primary surface. Accordingly, the electronic components are prevented from contacting the heat sink. Further, other electronic components may be mounted on an entire area of a second primary surface of the substrate.