Substrate Surface Treatment for Selective Protrusion Removal
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Solution Overview
Problem
Existing methods for removing the upper end of protrusions on substrates, such as those used in semiconductor and flat panel display manufacturing, often result in damage to the side walls and bottoms of recesses due to chemical and mechanical polishing, etching, or chemical solution penetration, leaving residues and making post-process treatments difficult.
Innovation Solution
A substrate treatment method involving the application of a first liquid to form protective layers on the substrate surface, followed by the use of a second liquid to physically remove these layers from the protrusions, thereby minimizing contact with the substrate's surface and recesses, using a combination of liquids and a removal member to ensure minimal damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If CMP process is used to remove the upper end of protrusion, then the protrusion can be removed, but the side wall or bottom portion of the recess may be damaged and abrasive may remain inside the recess
Solution Approach 1:
The invention divides the treatment into two distinct stages: first applying a protective layer to specific regions (protrusions) before removal, then selectively removing only the protected protrusions. This segmentation allows the recess areas to remain unprotected and thus unaffected by harmful chemicals or abrasives, while the protrusions receive targeted treatment.
Solution Approach 2:
The protective layer acts as an intermediary substance that is applied to the protrusions before removal. This intermediary layer protects the protrusion regions during the removal process, enabling precise removal without the harmful effects reaching the recess side walls and bottoms, thereby resolving the contradiction between effective protrusion removal and recess protection.
2Manufacturing precision
If dry etching process is used to remove the upper end of protrusion, then microfabrication precision is improved, but etching proceeds to the inside of the recess causing damage to side wall and bottom
Solution Approach 1:
The invention segments the substrate surface into protrusion regions and recess regions, applying the protective layer only to the protrusions. This spatial segmentation ensures that when etching is performed, only the protected protrusion areas are affected, while the recess interiors remain completely untouched by the etching process, thus achieving high precision without collateral damage.
Solution Approach 2:
The protective layer is applied in advance (preliminarily) to the protrusions before the etching process begins. This preliminary protective action creates a barrier that prevents the etching chemicals from reaching and damaging the recess side walls and bottoms, while still allowing precise etching of the protrusion upper ends.
3Manufacturing precision
If wet etching process is used to chemically remove the upper end of protrusion, then chemical removal is achieved, but the chemical solution penetrates into the recess causing damage to side wall and bottom
Solution Approach 1:
The protective layer serves as an intermediary barrier that is applied to the protrusions before chemical etching. This intermediary layer allows the chemical solution to be supplied for effective protrusion removal while preventing the solution from penetrating into the recess areas, thus eliminating chemical damage to the recess side walls and bottoms.
4Manufacturing precision
If an uneven member functioning as catalyst is pressed against the substrate surface to remove protrusion, then localized removal is achieved, but removal residue may be left on the surface and chemical solution may penetrate the recess causing damage
Solution Approach 1:
The invention replaces the mechanical catalyst pressing method with a chemical deposition method. Instead of using an uneven catalytic member that physically contacts and removes material (which leaves residues), the protective layer is deposited chemically onto the protrusions. This substitution eliminates mechanical contact and residue generation, while the protective layer still enables localized chemical removal without solution penetration into recesses.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively removes protrusions while protecting the substrate's side walls and bottoms from damage, ensuring cleaner and more efficient post-process treatments by preventing residue formation and abrasive retention.
Implementation Method 1
a first liquid is supplied on a surface of the substrate... form protective layers from the first liquid supplied on the surface of the substrate
Data Source
AI summary
According to one embodiment, a substrate treatment method of removing an upper end of a protrusion on a substrate is disclosed. An unevenness is formed on a surface of the substrate. The method can supply a first liquid on the surface of the substrate. The unevenness is formed on the surface. The method can form a protective layer. The protective layer covers the surface of the substrate from the first liquid supplied to the surface of the substrate. The method can supply a second liquid onto the protective layer. In addition the method can physically remove the protective layer which is on the upper end of the protrusion, and can bring the second liquid into contact with the upper end of the protrusion. The protective layer is removed from the upper end of the protrusion.