Substrate Processing With Rear-Surface Preheating for Uniformity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The temperature difference between the central and peripheral portions of a substrate during chemical liquid processing leads to discrepancies in processing uniformity, as the chemical liquid cools upon diffusion, affecting the substrate's surface properties.
Innovation Solution
A method involving the pre-heating of the substrate by supplying a heated fluid to its rear surface before applying a chemical liquid to its front surface, adjusting the temperature of the chemical liquid and heated fluid based on discharge standby time to maintain optimal processing conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If chemical liquid is supplied to the substrate to perform chemical liquid processing, then the substrate surface properties are modified, but the chemical liquid temperature decreases during diffusion causing temperature difference between central and peripheral portions
Solution Approach 1:
The substrate is pre-heated by supplying a heated fluid to the rear surface before the chemical liquid is supplied to the front surface. This preliminary heating action raises the overall substrate temperature, compensating for the temperature decrease that occurs when chemical liquid is applied, thereby maintaining temperature uniformity across the substrate surface during processing.
Solution Approach 2:
A heated fluid is introduced as an intermediary substance to transfer thermal energy to the substrate rear surface. This heated fluid acts as a mediator between the heating system and the substrate, enabling controlled temperature elevation and distribution without directly contacting the chemical liquid processing area, thus maintaining temperature uniformity during chemical liquid processing.
2Manufacturing precision
If a heated fluid is supplied to the rear surface of the substrate prior to chemical liquid supply, then the substrate temperature is equalized, but the system complexity increases due to additional fluid supply control
Solution Approach 1:
The fluid supply system is designed to supply both chemical liquid and heated fluid through integrated control mechanisms. The chemical liquid supply unit and heated fluid supply unit share common control architecture and coordination logic, allowing the system to perform multiple functions (chemical processing and thermal management) without proportionally increasing complexity.
Solution Approach 2:
The system controls temperature uniformity by adjusting parameters such as heated fluid temperature, flow rate, and supply timing based on discharge standby time. By dynamically changing these parameters rather than adding complex hardware, the system achieves precise temperature control while minimizing structural complexity.
3Manufacturing precision
If the temperature of chemical liquid and heated fluid is adjusted based on discharge standby time, then processing consistency is maintained, but the control system complexity increases
Solution Approach 1:
The control system adjusts temperature parameters of both chemical liquid and heated fluid based on discharge standby time. By changing physical parameters (temperature, flow rate) in response to operational conditions rather than adding complex control hardware, the system maintains processing consistency with minimal complexity increase.
Solution Approach 2:
The control unit monitors discharge standby time and uses this information to adjust the temperature of chemical liquid and heated fluid accordingly. This feedback mechanism ensures processing consistency by compensating for temperature variations that occur during different operational intervals without requiring complex predictive control systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures uniform chemical liquid processing across the substrate by compensating for temperature variations, enhancing processing efficiency and consistency.
Implementation Method 1
heating the substrate by starting a supply of a heated fluid to a second surface of the substrate
Implementation Method 2
the temperature of the chemical liquid decreases while it diffuses on the substrate toward a peripheral portion thereof
Data Source
AI summary
A substrate processing method includes processing a first surface of a substrate by a chemical liquid supplied to the first surface from a chemical liquid supply; and heating the substrate by starting a supply of a heated fluid to a second surface of the substrate prior to a start of a supply of the chemical liquid to the first surface of the substrate. A temperature of at least one of the chemical liquid to be supplied to the first surface or the heated fluid to be supplied to the second surface is adjusted based on a chemical liquid discharge standby time during which a discharge of the chemical liquid from the chemical liquid supply is not performed continuously.