Substrate Recess Bonding Structure for Thermal Shock Reliability
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Solution Overview
Problem
High-power modules face high costs due to expensive spacer materials, and cheaper alternatives may not ensure reliability, particularly in terms of thermal shock lifetime.
Innovation Solution
Incorporating a recess in the substrate to increase the thickness of the conductive-bonding component, allowing for a thicker solder bond with cheaper spacer materials like aluminum, enhancing thermal shock lifetime and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If expensive reliable spacer materials are used, then reliability is improved, but cost increases
Solution Approach 1:
The substrate is designed with a recess at specific locations where conductive-bonding components are placed, creating local structural variation. This recess allows increased thickness of the conductive-bonding component only where needed for reliability, while maintaining thinner sections elsewhere to reduce overall cost and material usage.
Solution Approach 2:
The thickness of the conductive-bonding component is varied by changing the substrate geometry (creating a recess). This parameter change allows the bonding component to be thicker and more reliable at critical locations while keeping the overall structure cost-effective by not uniformly increasing thickness across the entire substrate.
2Ease of manufacture
If cheaper spacer materials are used, then cost is reduced, but reliability deteriorates
Solution Approach 1:
The recess creates a localized region where the conductive-bonding component can be thicker and more substantial, providing enhanced reliability at the critical bonding interface. This allows cheaper spacer materials to be used overall while maintaining reliability at the specific location where the recess provides structural reinforcement.
Solution Approach 2:
Instead of uniformly increasing the thickness or changing material composition throughout the entire spacer structure, the solution introduces a vertical dimension change through the recess, concentrating the reliability enhancement in the bonding region while keeping the rest of the structure thin and cost-effective.
3Reliability
If the conductive-bonding component thickness is increased, then reliability is improved, but device complexity increases
Solution Approach 1:
The substrate is modified with a recess only at the specific location where the conductive-bonding component requires increased thickness for reliability. This localized modification avoids the need for complex substrate structures throughout, maintaining simplicity in non-critical areas while providing enhanced bonding reliability where needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces costs by using cheaper spacer materials while increasing the thermal shock lifetime and reliability of high-power modules, making them suitable for applications like hybrid electric vehicles.
Implementation Method 1
a conductive-bonding component (120). The conductive-bonding component is disposed between the semiconductor component (110) and the substrate (130)
Data Source
AI summary
In one general aspect, an apparatus can include a semiconductor component, a substrate including a recess, and a conductive-bonding component. The conductive-bonding component is disposed between the semiconductor component and the substrate. The conductive-bonding component has a first thickness between a bottom of the recess and a bottom surface of the semiconductor component greater than a second thickness between the top of the substrate and the bottom surface of the semiconductor component.