Substrate Recess Bonding Structure for Thermal Shock Reliability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High-power modules face challenges with expensive spacer materials that are reliable, while cheaper alternatives may not provide adequate reliability, particularly in thermal shock resistance.
Innovation Solution
Incorporating recesses in the substrate to increase the thickness of the conductive-bonding component, allowing for the use of cheaper spacer materials like aluminum with copper plating, enhancing thermal shock lifetime and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If expensive spacer materials are used, then reliability is improved, but cost increases
Solution Approach 1:
The substrate is designed with a recess that creates a localized thick region of conductive-bonding material only where needed for thermal shock resistance. This allows the use of cheaper spacer materials in regions where high reliability is not critical, while maintaining enhanced reliability in the recess area where thermal shock resistance is required.
Solution Approach 2:
The invention transitions from a uniform two-dimensional spacer configuration to a three-dimensional structure with a recess. This vertical dimensionality change allows the conductive-bonding material to have varying thickness, creating a thick region in the recess that provides superior thermal shock resistance without requiring expensive materials throughout the entire spacer structure.
2Ease of manufacture
If cheaper spacer materials are used, then cost is reduced, but thermal shock resistance deteriorates
Solution Approach 1:
The recess creates a localized region with enhanced thermal shock resistance properties. By concentrating the thick conductive-bonding material in this specific area, the design achieves superior thermal shock resistance where needed while allowing cheaper materials to be used in other regions, thus reducing overall cost.
Solution Approach 2:
The structure effectively creates a composite configuration where the conductive-bonding material forms a thick region within the recess and a thinner region outside. This composite structure combines the benefits of high reliability in the recess area with cost-effectiveness in the surrounding areas, allowing cheaper spacer materials to be used overall while maintaining adequate thermal shock resistance.
Data Source
AI summary
In one general aspect, an apparatus can include a substrate including a channel. The apparatus can also include a device stack. The device stack is coupled to the substrate via a conductive-bonding component. The channel has an inner edge and an outer edge. The inner edge defines a mesa disposed below the device stack. The outer edge being disposed outside of an outer perimeter of the device stack